Inventor · disambiguated record
Jing Ruei Lu
Also filed as: LU JING · LU JING RUEI
18 granted patents·3 pending applications·86 citations·filing 2010–2023
93Inventor score
Top patents by PatentIndex Score
21 records- 0191US9583474B2Package on packaging structure and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·7 cites·20 claims
- 0291US9349663B2Package-on-package structure having polymer-based material for warpage controlCHEN MENG-TSE·Filed 2012·Granted May 24, 2016·9 cites·20 claims
- 0391US8288208B1Apparatus and methods for semiconductor packages with improved warpageLIU YU-CHIH·Filed 2011·Granted Oct 16, 2012·17 cites·15 claims
- 0486US11417643B2Package-on-package with redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 16, 2022·3 cites·20 claims
- 0585US8731910B2Compensator and compensation method for audio frame loss in modified discrete cosine transform domainWU MING·Filed 2010·Granted May 20, 2014·17 cites·19 claims
- 0684US9627355B2Package-on-package structure having polymer-based material for warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 18, 2017·3 cites·20 claims
- 0783US9887144B2Ring structure for chip packagingLIN WEN YI·Filed 2011·Granted Feb 6, 2018·7 cites·20 claims
- 0882US8694325B2Hierarchical audio coding, decoding method and systemLIN ZHIBIN·Filed 2010·Granted Apr 8, 2014·14 cites·22 claims
- 0979US11725120B2Carrier tape system and methods of making and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 15, 2023·2 cites·20 claims
- 1075US9793242B2Packages with die stack including exposed molding underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 17, 2017·3 cites·20 claims
- 1174US9666556B2Flip chip packagingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 30, 2017·2 cites·20 claims
- 1268US2023340298A1Carrier tape system and methods of making and using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1365US9147584B2Rotating curingLU JING RUEI·Filed 2011·Granted Sep 29, 2015·2 cites·19 claims
- 1462US11133285B2Package-on-package structure having polymer-based material for warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 28, 2021·0 cites·20 claims
- 1558US10269763B2Package-on-package structure having polymer-based material for warpage controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 1657US10515941B2Methods of forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·20 claims
- 1757US9859265B2Package structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 2, 2018·0 cites·20 claims
- 1850US8946888B2Package on packaging structure and methods of making sameLIN WEN-YI·Filed 2011·Granted Feb 3, 2015·0 cites·27 claims
- 1949US2018033775A1Packages with Die Stack Including Exposed Molding UnderfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Application pending·0 cites
- 2042US2016226543A1Card holder and mobile terminalZTE CORP·Filed 2014·Application pending·0 cites
- 2139US8993378B2Flip-chip BGA assembly processLIU YU-CHIH·Filed 2011·Granted Mar 31, 2015·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →