Inventor · disambiguated record
Gotthard Jungnickel
Also filed as: JUNGNICKEL GOTTHARD
7 granted patents·4 pending applications·47 citations·filing 2001–2013
83Inventor score
Files withADVANCED MICRO DEVICES INC4GLOBALFOUNDRIES INC3JUNGNICKEL GOTTHARD1KUECHENMEISTER FRANK1LEHR MATTHIAS1
Top patents by PatentIndex Score
11 records- 0178US8580672B2Methods of forming bump structures that include a protection layerKUECHENMEISTER FRANK·Filed 2011·Granted Nov 12, 2013·7 cites·15 claims
- 0273US7829453B2Method for forming solder balls with a stable oxide layer by controlling the reflow ambientGLOBALFOUNDRIES INC·Filed 2006·Granted Nov 9, 2010·6 cites·24 claims
- 0372US7585759B2Technique for efficiently patterning an underbump metallization layer using a dry etch processADVANCED MICRO DEVICES INC·Filed 2006·Granted Sep 8, 2009·7 cites·29 claims
- 0471US7491556B2Efficient method of forming and assembling a microelectronic chip including solder bumpsADVANCED MICRO DEVICES INC·Filed 2005·Granted Feb 17, 2009·6 cites·8 claims
- 0569US6720242B2Method of forming a substrate contact in a field effect transistor formed over a buried insulator layerADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 13, 2004·18 cites·15 claims
- 0666US7569937B2Technique for forming a copper-based contact layer without a terminal metalADVANCED MICRO DEVICES INC·Filed 2006·Granted Aug 4, 2009·3 cites·6 claims
- 0748US2014021604A1Integrated circuit devices with bump structures that include a protection layerGLOBALFOUNDRIES INC·Filed 2013·Application pending·0 cites
- 0842US2008203571A1Backside metallization for integrated circuit devicesJUNGNICKEL GOTTHARD·Filed 2007·Application pending·0 cites
- 0941US2008099913A1Metallization layer stack without a terminal aluminum metal layerLEHR MATTHIAS·Filed 2007·Application pending·0 cites
- 1032US8384218B2Back side metallization with superior adhesion in high-performance semiconductor devicesGLOBALFOUNDRIES INC·Filed 2010·Granted Feb 26, 2013·0 cites·23 claims
- 1129US2012052677A1Method for Forming Lead-Free Solder Balls with a Stable Oxide Layer Based on a Plasma ProcessZENNER SOEREN·Filed 2011·Application pending·0 cites
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