Inventor · disambiguated record
Tong Yan Tee
Also filed as: TEE TONG YAN
9 granted patents·42 citations·filing 2003–2012
84Inventor score
Files withST MICROELECTRONICS INC2TEE TONG YAN2CHIU ANTHONY M1GOH KIM-YONG1ST MICROELECTRONICS ASIA1
Top patents by PatentIndex Score
9 records- 0189US8018036B2Ultra-thin quad flat no-lead (QFN) packageST MICROELECTRONICS ASIA·Filed 2006·Granted Sep 13, 2011·18 cites·26 claims
- 0285US8486824B2Enhancing metal/low-K interconnect reliability using a protection layerTEE TONG YAN·Filed 2012·Granted Jul 16, 2013·11 cites·20 claims
- 0367US8800391B2Piezo-resistive force sensor with bumps on membrane structureZHANG XUEREN·Filed 2007·Granted Aug 12, 2014·8 cites·24 claims
- 0461US8642396B2Ultra-thin quad flat no-lead (QFN) packageGOH KIM-YONG·Filed 2011·Granted Feb 4, 2014·1 cites·23 claims
- 0557US8217518B2Enhancing metal/low-K interconnect reliability using a protection layerTEE TONG YAN·Filed 2007·Granted Jul 10, 2012·2 cites·17 claims
- 0652US8524531B2System and method for improving solder joint reliability in an integrated circuit packageST MICROELECTRONICS INC·Filed 2012·Granted Sep 3, 2013·0 cites·20 claims
- 0746US7196425B2Copper interposer for reducing warping of integrated circuit packages and method of making IC packagesST MICROELECTRONICS INC·Filed 2004·Granted Mar 27, 2007·2 cites·20 claims
- 0839US8330258B2System and method for improving solder joint reliability in an integrated circuit packageCHIU ANTHONY M·Filed 2003·Granted Dec 11, 2012·0 cites·25 claims
- 0936US8592980B2Carbon nanotube-modified low-K materialsWANG SHANZHONG·Filed 2007·Granted Nov 26, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →