Assignee
GOH KIM-YONG
SG·9 granted patents·1 pending application·111 citations·filing 2008–2012
Top patents by PatentIndex Score
10 records- 0195US8884422B2Flip-chip fan-out wafer level package for package-on-package applications, and method of manufactureGOH KIM-YONG·Filed 2009·Granted Nov 11, 2014·46 cites·8 claims
- 0295US8436255B2Fan-out wafer level package with polymeric layer for high reliabilityGOH KIM-YONG·Filed 2009·Granted May 7, 2013·40 cites·12 claims
- 0386US8389335B2Chip Scale Package structure with can attachmentGOH KIM-YONG·Filed 2012·Granted Mar 5, 2013·7 cites·16 claims
- 0485US8466997B2Fan-out wafer level package for an optical sensor and method of manufacture thereofGOH KIM-YONG·Filed 2009·Granted Jun 18, 2013·8 cites·13 claims
- 0571US8502394B2Multi-stacked semiconductor dice scale package structure and method of manufacturing sameGOH KIM-YONG·Filed 2009·Granted Aug 6, 2013·5 cites·19 claims
- 0668US8164179B2Chip scale package structure with can attachmentGOH KIM-YONG·Filed 2008·Granted Apr 24, 2012·3 cites·11 claims
- 0761US8642396B2Ultra-thin quad flat no-lead (QFN) packageGOH KIM-YONG·Filed 2011·Granted Feb 4, 2014·1 cites·23 claims
- 0861US8410598B2Semiconductor package and method of manufacturing the sameGOH KIM-YONG·Filed 2010·Granted Apr 2, 2013·1 cites·8 claims
- 0944US8637352B2Ball grid array to pin grid array conversionGOH KIM-YONG·Filed 2011·Granted Jan 28, 2014·0 cites·12 claims
- 1037US2013147024A1Balanced leadframe package structure and method of manufacturing the sameGOH KIM-YONG·Filed 2011·Application pending·0 cites
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