Inventor · disambiguated record
Xueren Zhang
Also filed as: ZHANG XUEREN
14 granted patents·4 pending applications·52 citations·filing 2007–2017
89Inventor score
Files withST MICROELECTRONICS PTE LTD8ZHANG XUEREN4STMICROELECTRONICS (MALTA) LTD2TEE TONG YAN2GOH KIM-YONG1
Top patents by PatentIndex Score
18 records- 0191US9449912B1Integrated circuit (IC) card having an IC module and reduced bond wire stress and method of formingST MICROELECTRONICS PTE LTD·Filed 2015·Granted Sep 20, 2016·11 cites·24 claims
- 0285US8486824B2Enhancing metal/low-K interconnect reliability using a protection layerTEE TONG YAN·Filed 2012·Granted Jul 16, 2013·11 cites·20 claims
- 0381US9576912B1Wafer level chip scale package (WLCSP) having edge protectionST MICROELECTRONICS PTE LTD·Filed 2015·Granted Feb 21, 2017·4 cites·15 claims
- 0481US8772943B2Offset of contact opening for copper pillars in flip chip packagesZHANG XUEREN·Filed 2011·Granted Jul 8, 2014·7 cites·14 claims
- 0579US9620438B2Electronic device with heat dissipaterSTMICROELECTRONICS (MALTA) LTD·Filed 2015·Granted Apr 11, 2017·5 cites·23 claims
- 0667US8800391B2Piezo-resistive force sensor with bumps on membrane structureZHANG XUEREN·Filed 2007·Granted Aug 12, 2014·8 cites·24 claims
- 0764US8796826B2Window clamp top plate for integrated circuit packagingZHANG XUEREN·Filed 2011·Granted Aug 5, 2014·2 cites·29 claims
- 0862US9379034B1Method of making an electronic device including two-step encapsulation and related devicesST MICROELECTRONICS PTE LTD·Filed 2014·Granted Jun 28, 2016·1 cites·21 claims
- 0960US9257372B2Surface mount package for a semiconductor integrated device, related assembly and manufacturing processSTMICROELECTRONICS MALTA LTD·Filed 2013·Granted Feb 9, 2016·1 cites·16 claims
- 1059US10658238B2Semiconductor packages having an electric device with a recessST MICROELECTRONICS PTE LTD·Filed 2017·Granted May 19, 2020·0 cites·19 claims
- 1157US8217518B2Enhancing metal/low-K interconnect reliability using a protection layerTEE TONG YAN·Filed 2007·Granted Jul 10, 2012·2 cites·17 claims
- 1254US9824924B2Semiconductor packages having an electric device with a recessST MICROELECTRONICS PTE LTD·Filed 2013·Granted Nov 21, 2017·0 cites·16 claims
- 1343US9679870B2Integrated circuit device with shaped leads and method of forming the deviceST MICROELECTRONICS PTE LTD·Filed 2014·Granted Jun 13, 2017·0 cites·10 claims
- 1442US2015084171A1No-lead semiconductor package and method of manufacturing the sameST MICROELECTRONICS PTE LTD·Filed 2013·Application pending·0 cites
- 1537US2013147024A1Balanced leadframe package structure and method of manufacturing the sameGOH KIM-YONG·Filed 2011·Application pending·0 cites
- 1636US8592980B2Carbon nanotube-modified low-K materialsWANG SHANZHONG·Filed 2007·Granted Nov 26, 2013·0 cites·20 claims
- 1736US2013093072A1Leadframe pad design with enhanced robustness to die crack failureZHANG XUEREN·Filed 2011·Application pending·0 cites
- 1833US2016293512A1Electronic device with dummy ic die and related methodsST MICROELECTRONICS PTE LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →