Inventor · disambiguated record
Daniel Lau
Also filed as: LAU DANIEL · LAU DANIEL K
5 granted patents·1 pending application·157 citations·filing 2003–2014
81Inventor score
Top patents by PatentIndex Score
6 records- 0192US7259445B2Thermal enhanced package for block mold assemblyADVANCED INTERCONNECT TECH LTD·Filed 2003·Granted Aug 21, 2007·101 cites·13 claims
- 0272US7563648B2Semiconductor device package and method for manufacturing sameUNISEM MAURITIUS HOLDINGS LTD·Filed 2004·Granted Jul 21, 2009·23 cites·33 claims
- 0372US7247933B2Thin multiple semiconductor die packageADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Jul 24, 2007·16 cites·18 claims
- 0465US7489021B2Lead frame with included passive devicesADVANCED INTERCONNECT TECH LTD·Filed 2004·Granted Feb 10, 2009·17 cites·35 claims
- 0541US10902026B2Block classified termLONGSAND LTD·Filed 2014·Granted Jan 26, 2021·0 cites·18 claims
- 0640US2007065984A1Thermal enhanced package for block mold assemblyLAU DANIEL K·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →