Inventor · disambiguated record
Nirmal Sharma
Also filed as: SHARMA NIRMAL · SHARMA NIRMAL K
14 granted patents·9 pending applications·868 citations·filing 1987–2025
95Inventor score
Files withALLEGRO MICROSYSTEMS LLC4ALLEGRO MICROSYSTEMS INC3SHARMA NIRMAL3ARARAO VIRGIL2INTERSIL CORP2
Top patents by PatentIndex Score
23 records- 0198US7361531B2Methods and apparatus for Flip-Chip-On-Lead semiconductor packageALLEGRO MICROSYSTEMS INC·Filed 2005·Granted Apr 22, 2008·86 cites·19 claims
- 0298US6995315B2Current sensorALLEGRO MICROSYSTEMS INC·Filed 2005·Granted Feb 7, 2006·100 cites·20 claims
- 0397US7816772B2Methods and apparatus for multi-stage molding of integrated circuit packageALLEGRO MICROSYSTEMS INC·Filed 2007·Granted Oct 19, 2010·81 cites·7 claims
- 0495US8143169B2Methods for multi-stage molding of integrated circuit packageENGEL RAYMOND W·Filed 2010·Granted Mar 27, 2012·72 cites·10 claims
- 0594US8461677B2Magnetic field sensors and methods for fabricating the magnetic field sensorsARARAO VIRGIL·Filed 2011·Granted Jun 11, 2013·33 cites·10 claims
- 0694US6420779B1Leadframe based chip scale package and method of producing the sameST ASSEMBLY TEST SERVICES LTD·Filed 1999·Granted Jul 16, 2002·263 cites·8 claims
- 0793US8486755B2Magnetic field sensors and methods for fabricating the magnetic field sensorsARARAO VIRGIL·Filed 2008·Granted Jul 16, 2013·33 cites·10 claims
- 0891US9228860B2Sensor and method of providing a sensorSHARMA NIRMAL·Filed 2011·Granted Jan 5, 2016·35 cites·9 claims
- 0986US6809416B1Package for integrated circuit with thermal vias and method thereofINTERSIL CORP·Filed 2002·Granted Oct 26, 2004·38 cites·8 claims
- 1084US4731701AIntegrated circuit package with thermal path layers incorporating staggered thermal viasFAIRCHILD SEMICONDUCTOR·Filed 1987·Granted Mar 15, 1988·89 cites·4 claims
- 1183US6861283B2Package for integrated circuit with thermal vias and method thereofINTERSIL CORP·Filed 2003·Granted Mar 1, 2005·31 cites·6 claims
- 1270US2025381661A1Distributed robot controllerDEXTERITY INC·Filed 2025·Application pending·0 cites
- 1365US2020355525A1Methods and apparatus for passive attachment of components for integrated circuitsALLEGRO MICROSYSTEMS LLC·Filed 2020·Application pending·0 cites
- 1453US2013264667A1Magnetic Field Sensors and Methods for Fabricating the Magnetic Field SensorsALLEGRO MICROSYSTEMS LLC·Filed 2013·Application pending·0 cites
- 1553US2013267043A1Magnetic Field Sensors and Methods for Fabricating the Magnetic Field SensorsALLEGRO MICROSYSTEMS LLC·Filed 2013·Application pending·0 cites
- 1651US8785250B2Methods and apparatus for flip-chip-on-lead semiconductor packageSHARMA NIRMAL·Filed 2008·Granted Jul 22, 2014·0 cites·16 claims
- 1750US6646343B1Matched impedance bonding technique in high-speed integrated circuitsBITBLITZ COMMUNICATIONS INC·Filed 2002·Granted Nov 11, 2003·7 cites·12 claims
- 1849US2015285874A1Methods and Apparatus for Passive Attachment of Components for Integrated CircuitsALLEGRO MICROSYSTEMS LLC·Filed 2015·Application pending·0 cites
- 1948US2007279053A1Integrated current sensorTAYLOR WILLIAM P·Filed 2007·Application pending·0 cites
- 2046US2008013298A1Methods and apparatus for passive attachment of components for integrated circuitsSHARMA NIRMAL·Filed 2006·Application pending·0 cites
- 2146US2006219436A1Current sensorTAYLOR WILLIAM P·Filed 2006·Application pending·0 cites
- 2235US8344301B2Rapid and homogenous heat treatment of large metallic sample using high power microwavesBHARAT HEAVY ELECTRICALS·Filed 2006·Granted Jan 1, 2013·0 cites·4 claims
- 2335US2018233410A1Wafer dicing methodsPSEMI CORP·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →