Inventor · disambiguated record
Robert C. Marrs
Also filed as: MARRS ROBERT · MARRS ROBERT C
14 granted patents·1,992 citations·filing 1992–2015
96Inventor score
Top patents by PatentIndex Score
14 records- 0198US5701034APackaged semiconductor die including heat sink with locking featureAMKOR ELECTRONICS INC·Filed 1994·Granted Dec 23, 1997·325 cites·13 claims
- 0298US5355283ABall grid array with via interconnectionAMKOR ELECTRONICS INC·Filed 1993·Granted Oct 11, 1994·568 cites·17 claims
- 0397US5478007AMethod for interconnection of integrated circuit chip and substrateAMKOR ELECTRONICS INC·Filed 1994·Granted Dec 26, 1995·154 cites·13 claims
- 0494US5583378ABall grid array integrated circuit package with thermal conductorAMKOR ELECTRONICS INC·Filed 1994·Granted Dec 10, 1996·290 cites·40 claims
- 0594US5485037ASemiconductor device having a thermal dissipator and electromagnetic shieldingAMKOR ELECTRONICS INC·Filed 1995·Granted Jan 16, 1996·174 cites·18 claims
- 0691US5795818AIntegrated circuit chip to substrate interconnection and methodAMKOR TECHNOLOGY INC·Filed 1996·Granted Aug 18, 1998·115 cites·17 claims
- 0787US5482898AMethod for forming a semiconductor device having a thermal dissipator and electromagnetic shieldingAMKOR ELECTRONICS INC·Filed 1995·Granted Jan 9, 1996·84 cites·19 claims
- 0884US9732780B2Cantilever assemblyIMPULSE NC LLC·Filed 2015·Granted Aug 15, 2017·8 cites·15 claims
- 0978US6163463AIntegrated circuit chip to substrate interconnectionAMKOR TECHNOLOGY INC·Filed 1998·Granted Dec 19, 2000·46 cites·7 claims
- 1077US5328870AMethod for forming plastic molded package with heat sink for integrated circuit devicesAMKOR ELECTRONICS INC·Filed 1992·Granted Jul 12, 1994·51 cites·21 claims
- 1176US5455462APlastic molded package with heat sink for integrated circuit devicesAMKOR ELECTRONICS INC·Filed 1993·Granted Oct 3, 1995·48 cites·22 claims
- 1275US5722161AMethod of making a packaged semiconductor die including heat sink with locking featureAMKOR ELECTRONICS INC·Filed 1996·Granted Mar 3, 1998·43 cites·21 claims
- 1375US5483100AIntegrated circuit package with via interconnections formed in a substrateAMKOR ELECTRONICS INC·Filed 1992·Granted Jan 9, 1996·45 cites·11 claims
- 1474US5378869AMethod for forming an integrated circuit package with via interconnectionAMKOR ELECTRONICS INC·Filed 1993·Granted Jan 3, 1995·41 cites·28 claims
Join the waitlist — get patent alerts
Get an alert when Robert C. Marrs files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →