Inventor · disambiguated record
Sang-Ho An
Also filed as: AN SANG-HO
7 granted patents·9 pending applications·68 citations·filing 2003–2018
84Inventor score
Top patents by PatentIndex Score
16 records- 0188US9496216B2Semiconductor package including stacked semiconductor chips and a redistribution layerCHUN SUNG-HOON·Filed 2012·Granted Nov 15, 2016·20 cites·30 claims
- 0286US7368811B2Multi-chip package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 6, 2008·16 cites·23 claims
- 0385US8838885B2Solid state drive packages and related methods and systemsKWAK DONG-OK·Filed 2012·Granted Sep 16, 2014·11 cites·18 claims
- 0482US8791554B2Substrates for semiconductor devices including internal shielding structures and semiconductor devices including the substratesKWAK DONG-OK·Filed 2012·Granted Jul 29, 2014·8 cites·20 claims
- 0565US9379062B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jun 28, 2016·2 cites·20 claims
- 0659US7030489B2Multi-chip module having bonding wires and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Apr 18, 2006·8 cites·20 claims
- 0753US2020017978A1Composition for cleaning mask and method for cleaning mask using the sameSOULBRAIN CO LTD·Filed 2018·Application pending·0 cites
- 0847US7371675B2Method and apparatus for bonding a wireSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted May 13, 2008·3 cites·22 claims
- 0945US2006125093A1Multi-chip module having bonding wires and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1041US2007001284A1Semiconductor package having lead free conductive bumps and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Application pending·0 cites
- 1141US2007252256A1Package-on-package structuresLIM GWANG-MAN·Filed 2007·Application pending·0 cites
- 1237US2004262774A1Multi-chip packages having a plurality of flip chips and methods of manufacturing the sameFiled 2004·Application pending·0 cites
- 1337US2006151865A1Semiconductor chip stack package having dummy chipHAN CHANG-HOON·Filed 2005·Application pending·0 cites
- 1436US2012061816A1Semiconductor package and method of fabricating the sameSONG SANG-SUB·Filed 2011·Application pending·0 cites
- 1534US2007035009A1Printed circuit board, semiconductor package and multi-stack semiconductor package using the sameHWANG SUNG-WOOK·Filed 2006·Application pending·0 cites
- 1634US2012068306A1Semiconductor package including decoupling semiconductor capacitorSONG SANG-SUB·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →