Inventor · disambiguated record
Hiroaki Iuchi
Also filed as: IUCHI HIROAKI
13 granted patents·3 pending applications·683 citations·filing 2007–2024
93Inventor score
Files withSANDISK TECHNOLOGIES INC7SANDISK 3D LLC3MICRON TECHNOLOGY INC2SANDISK TECHNOLOGIES LLC2KINOSHITA HIROYUKI1
Top patents by PatentIndex Score
16 records- 0197US9837431B23D semicircular vertical NAND string with recessed inactive semiconductor channel sectionsSANDISK TECHNOLOGIES INC·Filed 2016·Granted Dec 5, 2017·26 cites·24 claims
- 0296US9236392B1Multiheight electrically conductive via contacts for a multilevel interconnect structureSANDISK TECHNOLOGIES INC·Filed 2014·Granted Jan 12, 2016·81 cites·26 claims
- 0395US9123577B2Air gap isolation in non-volatile memory using sacrificial filmsSANDISK TECHNOLOGIES INC·Filed 2012·Granted Sep 1, 2015·468 cites·22 claims
- 0494US9601508B2Blocking oxide in memory opening integration scheme for three-dimensional memory structureSANDISK TECHNOLOGIES INC·Filed 2015·Granted Mar 21, 2017·11 cites·15 claims
- 0594US9401309B2Multiheight contact via structures for a multilevel interconnect structureSANDISK TECHNOLOGIES INC·Filed 2014·Granted Jul 26, 2016·24 cites·30 claims
- 0691US9728499B2Set of stepped surfaces formation for a multilevel interconnect structureSANDISK TECHNOLOGIES INC·Filed 2014·Granted Aug 8, 2017·14 cites·12 claims
- 0791US8802561B1Method of inhibiting wire collapseSANDISK 3D LLC·Filed 2013·Granted Aug 12, 2014·25 cites·20 claims
- 0889US9281314B1Non-volatile storage having oxide/nitride sidewallSANDISK TECHNOLOGIES INC·Filed 2014·Granted Mar 8, 2016·11 cites·19 claims
- 0987US9691778B2Multiheight contact via structures for a multilevel interconnect structureSANDISK TECHNOLOGIES LLC·Filed 2016·Granted Jun 27, 2017·5 cites·24 claims
- 1087US8937011B2Method of forming crack free gap fillSANDISK 3D LLC·Filed 2013·Granted Jan 20, 2015·11 cites·21 claims
- 1178US9818798B2Vertical thin film transistors in non-volatile storage systemsSANDISK TECHNOLOGIES LLC·Filed 2016·Granted Nov 14, 2017·2 cites·14 claims
- 1272US9362338B2Vertical thin film transistors in non-volatile storage systemsSANDISK 3D LLC·Filed 2014·Granted Jun 7, 2016·2 cites·16 claims
- 1364US7759722B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Granted Jul 20, 2010·3 cites·17 claims
- 1458US2024332179A1Tier recess methodMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1557US2024071819A1Stress mitigation for three-dimensional metal contactsMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1639US2013307044A1Selective Air Gap Isolation In Non-Volatile MemoryKINOSHITA HIROYUKI·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →