Inventor · disambiguated record
Myung Geun Park
Also filed as: PARK MYUNG G · PARK MYUNG GEUN
12 granted patents·4 pending applications·241 citations·filing 1995–2019
90Inventor score
Files withHYNIX SEMICONDUCTOR INC4HYUNDAI ELECTRONICS IND2KIM KI-YOUNG2KIM SEONG CHEOL2PARK MYUNG GEUN2
Top patents by PatentIndex Score
16 records- 0190US6316825B1Chip stack package utilizing a connecting hole to improve electrical connection between leadframesHYUNDAI ELECTRONICS IND·Filed 1999·Granted Nov 13, 2001·112 cites·6 claims
- 0285US8680652B2Stack packageSK HYNIX INC·Filed 2012·Granted Mar 25, 2014·7 cites·2 claims
- 0385US5577039ASystem and method of signal transmission within a plesiochronous digital hierarchy unit using ATM adaptation layersSAMSUNG ELECTRONICS INC·Filed 1995·Granted Nov 19, 1996·91 cites·12 claims
- 0472US7417308B2Stack type package module and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2005·Granted Aug 26, 2008·6 cites·5 claims
- 0570US6677181B2Method for fabricating stacked chip package deviceHYUNDAI ELECTRONICS IND·Filed 2001·Granted Jan 13, 2004·16 cites·10 claims
- 0665US7595255B2Method for manufacturing strip level substrate without warpage and method for manufacturing semiconductor package using the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 29, 2009·2 cites·10 claims
- 0762US8581397B2Substrate for semiconductor package with improved bumping of chip bumps and contact pads and semiconductor package having the samePARK MYUNG GEUN·Filed 2008·Granted Nov 12, 2013·4 cites·18 claims
- 0860US11773417B2Microalgal strains of Thraustochytrium genus, and method of producing polyunsaturated fatty acids using the sameCJ CHEILJEDANG CORP·Filed 2019·Granted Oct 3, 2023·0 cites·9 claims
- 0960US8399998B2Semiconductor package requiring reduced manufacturing processesKIM KI YOUNG·Filed 2009·Granted Mar 19, 2013·2 cites·15 claims
- 1059US7859108B2Flip chip package and method for manufacturing the sameHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Dec 28, 2010·1 cites·19 claims
- 1153US2012205802A1Printed circuit board and flip chip package using the same with improved bump joint reliabilityKIM SEONG CHEOL·Filed 2012·Application pending·0 cites
- 1252US8183689B2Printed circuit board and flip chip package using the same with improved bump joint reliabilityKIM SEONG CHEOL·Filed 2007·Granted May 22, 2012·0 cites·5 claims
- 1344US2011186978A1Stack packageHYNIX SEMICONDUCTOR INC·Filed 2010·Application pending·0 cites
- 1442US9786590B2Semiconductor package including a conductive fabricSK HYNIX INC·Filed 2016·Granted Oct 10, 2017·0 cites·24 claims
- 1538US2009096079A1Semiconductor package having a warpage resistant substratePARK MYUNG GEUN·Filed 2008·Application pending·0 cites
- 1637US2012074529A1Semiconductor package with through electrodes and method for manufacturing the sameKIM KI-YOUNG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →