Inventor · disambiguated record
Christopher L. Tessler
Also filed as: TESSLER CHRISTOPHER L · TESSLER CHRISTOPHER LEE
21 granted patents·6 pending applications·201 citations·filing 1995–2016
94Inventor score
Files withIBM18COHEN JEROME D3BIGGS GLEN NELSON2GLOBALFOUNDRIES INC2SUSS MICROTEC PHOTONIC SYSTEMS INC2
Top patents by PatentIndex Score
27 records- 0192US7332424B2Fluxless solder transfer and reflow processIBM·Filed 2005·Granted Feb 19, 2008·27 cites·10 claims
- 0287US10090255B2Dicing channels for glass interposersGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 2, 2018·6 cites·20 claims
- 0386US10446442B2Integrated circuit chip with molding compound handler substrate and methodGLOBALFOUNDRIES INC·Filed 2016·Granted Oct 15, 2019·4 cites·20 claims
- 0484US9278401B2Fill head interface with combination vacuum pressure chamberIBM·Filed 2013·Granted Mar 8, 2016·5 cites·16 claims
- 0584US6892781B2Method and apparatus for application of pressure to a workpiece by thermal expansionIBM·Filed 2002·Granted May 17, 2005·38 cites·12 claims
- 0684US5609778AProcess for high contrast marking on surfaces using lasersIBM·Filed 1995·Granted Mar 11, 1997·49 cites·12 claims
- 0779US7833897B2Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surfaceIBM·Filed 2007·Granted Nov 16, 2010·7 cites·6 claims
- 0878US7513410B2Air bearing gap control for injection molded solder headsIBM·Filed 2007·Granted Apr 7, 2009·5 cites·14 claims
- 0972US7401637B2Pressure-only molten metal valving apparatus and methodIBM·Filed 2006·Granted Jul 22, 2008·3 cites·20 claims
- 1071US8237086B2Removing material from defective opening in glass moldCOHEN JEROME D·Filed 2008·Granted Aug 7, 2012·4 cites·8 claims
- 1167US6413868B1Modular high frequency integrated circuit structureIBM·Filed 2001·Granted Jul 2, 2002·13 cites·29 claims
- 1261US6765152B2Multichip module having chips on two sidesIBM·Filed 2002·Granted Jul 20, 2004·9 cites·13 claims
- 1358US6259148B1Modular high frequency integrated circuit structureIBM·Filed 1999·Granted Jul 10, 2001·21 cites·16 claims
- 1453US9254533B2Removing material from defective opening in glass moldCOHEN JEROME D·Filed 2012·Granted Feb 9, 2016·0 cites·9 claims
- 1553US8800952B2Removing material from defective opening in glass mold and related glass mold for injection molded solderCOHEN JEROME D·Filed 2012·Granted Aug 12, 2014·0 cites·4 claims
- 1652US9754823B2Substrate including selectively formed barrier layerIBM·Filed 2014·Granted Sep 5, 2017·0 cites·10 claims
- 1751US8123088B2Dispensing assembly with a controlled gas environmentBIGGS GLEN NELSON·Filed 2008·Granted Feb 28, 2012·0 cites·24 claims
- 1850US8123089B2Dispensing assembly with an injector controlled gas environmentBIGGS GLEN NELSON·Filed 2008·Granted Feb 28, 2012·0 cites·24 claims
- 1947US9748135B2Substrate including selectively formed barrier layerIBM·Filed 2015·Granted Aug 29, 2017·0 cites·3 claims
- 2047US2009179019A1Removing material from defective opening in glass moldIBM·Filed 2008·Application pending·0 cites
- 2147US2016184926A1Laser ablation system including variable energy beam to minimize etch-stop material damageSUSS MICROTEC PHOTONIC SYSTEMS INC·Filed 2014·Application pending·0 cites
- 2245US2009242614A1Method and tool for repositioning solder fill headIBM·Filed 2008·Application pending·0 cites
- 2345US2016204028A1Substrate including selectively formed barrier layerIBM·Filed 2016·Application pending·0 cites
- 2442US5905566ALaser ablation top surface reference chuckIBM·Filed 1997·Granted May 18, 1999·10 cites·10 claims
- 2542US2016074968A1Laser etching system including mask reticle for multi-depth etchingSUSS MICROTEC PHOTONIC SYSTEMS INC·Filed 2014·Application pending·0 cites
- 2641US6973715B2Method of forming a multichip module having chips on two sidesIBM·Filed 2003·Granted Dec 13, 2005·0 cites·6 claims
- 2739US2014192341A1Fixture planarity evaluation methodIBM·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →