Inventor · disambiguated record
Yongjin Jung
Also filed as: JUNG YONGJIN
3 granted patents·5 pending applications·13 citations·filing 2006–2016
64Inventor score
Top patents by PatentIndex Score
8 records- 0184US9698117B2Die bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jul 4, 2017·8 cites·20 claims
- 0261US9516133B2Information processing device, information processing method and information processing programNAKAMURA KENTARO·Filed 2008·Granted Dec 6, 2016·2 cites·26 claims
- 0359US7989939B2Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wireSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Aug 2, 2011·3 cites·14 claims
- 0448US2017031545A1Information processing device, information processing method and information processing programSONY CORP·Filed 2016·Application pending·0 cites
- 0543US2008189359A1Content providing method, content playback method, portable wireless terminal, and content playback apparatusSONY CORP·Filed 2008·Application pending·0 cites
- 0642US2008176596A1Communication apparatus, phone set, communication system, communication method and communication programSONY CORP·Filed 2008·Application pending·0 cites
- 0740US2007094274A1Content transfer apparatus, content transfer method and content transfer programSONY CORP·Filed 2006·Application pending·0 cites
- 0840US2006263068A1Reproducing apparatus, program, and reproduction control methodSONY CORP·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →