Inventor · disambiguated record
Toshiaki Akutsu
Also filed as: AKUTSU TOSHIAKI
14 granted patents·7 pending applications·39 citations·filing 2005–2018
88Inventor score
Top patents by PatentIndex Score
21 records- 0193US10196542B2Abrasive, abrasive set, and method for abrading substrateHITACHI CHEMICAL CO LTD·Filed 2015·Granted Feb 5, 2019·9 cites·56 claims
- 0288US9346978B2Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted May 24, 2016·9 cites·39 claims
- 0386US9932497B2Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted Apr 3, 2018·7 cites·36 claims
- 0486US9163162B2Polishing agent, polishing agent set and method for polishing baseHITACHI CHEMICAL CO LTD·Filed 2013·Granted Oct 20, 2015·7 cites·8 claims
- 0577US9346977B2Abrasive, abrasive set, and method for abrading substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted May 24, 2016·3 cites·13 claims
- 0671US10155886B2Polishing liquid for CMP, and polishing methodHITACHI CHEMICAL CO LTD·Filed 2014·Granted Dec 18, 2018·2 cites·11 claims
- 0762US9293344B2Cmp polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2005·Granted Mar 22, 2016·2 cites·16 claims
- 0858US10759968B2Abrasive, abrasive set, and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2018·Granted Sep 1, 2020·0 cites·17 claims
- 0957US10030172B2Abrasive, abrasive set, and method for polishing substrateHITACHI CHEMICAL CO LTD·Filed 2014·Granted Jul 24, 2018·0 cites·8 claims
- 1050US10549399B2Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted Feb 4, 2020·0 cites·35 claims
- 1149US8900335B2CMP polishing slurry and method of polishing substrateFUKASAWA MASATO·Filed 2010·Granted Dec 2, 2014·0 cites·8 claims
- 1249US2013059439A1Cmp polishing liquid, method for polishing substrate, and electronic componentHITACHI CHEMICAL CO LTD·Filed 2012·Application pending·0 cites
- 1348US2008254717A1Cmp Polishing Slurry and Method of Polishing SubstrateHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 1447US10557059B2Slurry, polishing-solution set, polishing solution, substrate polishing method, and substrateHITACHI CHEMICAL CO LTD·Filed 2013·Granted Feb 11, 2020·0 cites·39 claims
- 1547US10557058B2Polishing agent, polishing agent set, and substrate polishing methodHITACHI CHEMICAL CO LTD·Filed 2013·Granted Feb 11, 2020·0 cites·12 claims
- 1645US2012299158A1Cmp polishing liquid, method for polishing substrate, and electronic componentSHINODA TAKASHI·Filed 2010·Application pending·0 cites
- 1743US2007175104A1Polishing slurry for silicon oxide, additive liquid and polishing methodHITACHI CHEMICAL CO LTD·Filed 2006·Application pending·0 cites
- 1842US2010015806A1Cmp polishing slurry, additive liquid for cmp polishing slurry, and substrate-polishing processes using the sameFUKASAWA MASATO·Filed 2007·Application pending·0 cites
- 1941US2015129796A1Abrasive grains, slurry, polishing solution, and manufacturing methods thereforHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 2038US11046869B2Polishing liquid, polishing liquid set, and substrate polishing methodHITACHI CHEMICAL CO LTD·Filed 2016·Granted Jun 29, 2021·0 cites·22 claims
- 2135US2012214307A1Chemical-mechanical polishing liquid, and semiconductor substrate manufacturing method and polishing method using said polishing liquidYOSHIKAWA SHIGERU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →