Inventor · disambiguated record
Ioan Sauciuc
Also filed as: SAUCIUC IOAN
51 granted patents·20 pending applications·1,128 citations·filing 2001–2016
99Inventor score
Top patents by PatentIndex Score
71 records- 0198US7795711B2Microelectronic cooling apparatus and associated methodINTEL CORP·Filed 2005·Granted Sep 14, 2010·80 cites·23 claims
- 0297US7742299B2Piezo fans for cooling an electronic deviceINTEL CORP·Filed 2008·Granted Jun 22, 2010·68 cites·19 claims
- 0397US7321184B2Rake shaped fanINTEL CORP·Filed 2005·Granted Jan 22, 2008·58 cites·3 claims
- 0497US6845622B2Phase-change refrigeration apparatus with thermoelectric cooling element and methodsINTEL CORP·Filed 2003·Granted Jan 25, 2005·92 cites·26 claims
- 0596US7259965B2Integrated circuit coolant microchannel assembly with targeted channel configurationINTEL CORP·Filed 2005·Granted Aug 21, 2007·40 cites·14 claims
- 0696US7031155B2Electronic thermal managementINTEL CORP·Filed 2003·Granted Apr 18, 2006·119 cites·19 claims
- 0791US7550901B2Piezoelectric fan, cooling device containing same, and method of cooling a microelectronic device using sameINTEL CORP·Filed 2007·Granted Jun 23, 2009·21 cites·17 claims
- 0891US7248475B2Wireless device enclosure using piezoelectric cooling structuresINTEL CORP·Filed 2005·Granted Jul 24, 2007·37 cites·19 claims
- 0991US6917522B1Apparatus and method for cooling integrated circuit devicesINTEL CORP·Filed 2003·Granted Jul 12, 2005·64 cites·29 claims
- 1090US7939945B2Electrically conductive fluid interconnects for integrated circuit devicesINTEL CORP·Filed 2008·Granted May 10, 2011·19 cites·51 claims
- 1190US7539016B2Electromagnetically-actuated micropump for liquid metal alloy enclosed in cavity with flexible sidewallsINTEL CORP·Filed 2005·Granted May 26, 2009·17 cites·6 claims
- 1290US7348665B2Liquid metal thermal interface for an integrated circuit deviceINTEL CORP·Filed 2004·Granted Mar 25, 2008·54 cites·22 claims
- 1390US7340904B2Method and apparatus for removing heatINTEL CORP·Filed 2004·Granted Mar 11, 2008·63 cites·36 claims
- 1489US7265979B2Cooling integrated circuits using a cold plate with two phase thin film evaporationINTEL CORP·Filed 2004·Granted Sep 4, 2007·55 cites·18 claims
- 1587US7755186B2Cooling solutions for die-down integrated circuit packagesINTEL CORP·Filed 2007·Granted Jul 13, 2010·14 cites·6 claims
- 1686US7751189B2Cooling arrangement to cool components on circuit boardINTEL CORP·Filed 2007·Granted Jul 6, 2010·15 cites·13 claims
- 1785US9448278B2Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming sameINTEL CORP·Filed 2015·Granted Sep 20, 2016·5 cites·18 claims
- 1885US7554808B2Heat sink with thermoelectric moduleINTEL CORP·Filed 2006·Granted Jun 30, 2009·13 cites·32 claims
- 1985US6549407B1Heat exchanger retention mechanismINTEL CORP·Filed 2001·Granted Apr 15, 2003·40 cites·21 claims
- 2083US9347987B2Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming sameSCHROEDER CHRISTOPHER R·Filed 2009·Granted May 24, 2016·13 cites·20 claims
- 2183US7243705B2Integrated circuit coolant microchannel with compliant coverINTEL CORP·Filed 2005·Granted Jul 17, 2007·10 cites·2 claims
- 2282US7367195B2Application and removal of thermal interface materialINTEL CORP·Filed 2006·Granted May 6, 2008·8 cites·20 claims
- 2381US6609561B2Tunnel-phase change heat exchangerINTEL CORP·Filed 2001·Granted Aug 26, 2003·29 cites·26 claims
- 2480US7508671B2Computer system having controlled coolingINTEL CORP·Filed 2003·Granted Mar 24, 2009·28 cites·3 claims
- 2580US7327572B2Heat dissipating device with enhanced boiling/condensation structureINTEL CORP·Filed 2006·Granted Feb 5, 2008·8 cites·8 claims
- 2679US7692922B2Heatsink, method of manufacturing same, and microelectronic package containing sameINTEL CORP·Filed 2007·Granted Apr 6, 2010·10 cites·6 claims
- 2779US7633753B2Piezoelectric air jet augmented cooling for electronic devicesINTEL CORP·Filed 2007·Granted Dec 15, 2009·7 cites·19 claims
- 2879US7457116B2Method and system to cool memoryINTEL CORP·Filed 2006·Granted Nov 25, 2008·9 cites·18 claims
- 2978US7764499B2Electromagnetically-actuated micropump for liquid metal alloyINTEL CORP·Filed 2009·Granted Jul 27, 2010·6 cites·6 claims
- 3077US7779638B2Localized microelectronic cooling apparatuses and associated methods and systemsINTEL CORP·Filed 2005·Granted Aug 24, 2010·5 cites·23 claims
- 3177US6868898B2Heat pipe having an inner retaining wall for wicking componentsINTEL CORP·Filed 2003·Granted Mar 22, 2005·22 cites·28 claims
- 3276US8453467B2Hybrid heat exchangerHOOD III CHARLES D·Filed 2006·Granted Jun 4, 2013·6 cites·14 claims
- 3374US9943931B2High performance transient uniform cooling solution for thermal compression bonding processINTEL CORP·Filed 2016·Granted Apr 17, 2018·2 cites·8 claims
- 3474US7642698B2Dual direction rake piezo actuatorINTEL CORP·Filed 2007·Granted Jan 5, 2010·6 cites·17 claims
- 3574US7499278B2Method and apparatus for dissipating heat from an electronic deviceINTEL CORP·Filed 2005·Granted Mar 3, 2009·5 cites·20 claims
- 3673US9293428B2Low profile heat spreader and methodsINTEL CORP·Filed 2012·Granted Mar 22, 2016·3 cites·9 claims
- 3773US7638928B2Piezo actuator for coolingINTEL CORP·Filed 2005·Granted Dec 29, 2009·7 cites·11 claims
- 3872US6561267B2Heat sink and electronic circuit module including the sameINTEL CORP·Filed 2001·Granted May 13, 2003·18 cites·9 claims
- 3971US7538476B2Multi-layer piezoelectric actuators with conductive polymer electrodesINTEL CORP·Filed 2007·Granted May 26, 2009·5 cites·30 claims
- 4066US9434029B2High performance transient uniform cooling solution for thermal compression bonding processLI ZHIHUA·Filed 2011·Granted Sep 6, 2016·2 cites·36 claims
- 4166US7532476B2Flow solutions for microelectronic coolingINTEL CORP·Filed 2006·Granted May 12, 2009·3 cites·26 claims
- 4264US9612060B2Direct air impingement cooling of package structuresSAUCIUC IOAN·Filed 2011·Granted Apr 4, 2017·2 cites·13 claims
- 4364US6971442B2Method and apparatus for dissipating heat from an electronic deviceINTEL CORP·Filed 2001·Granted Dec 6, 2005·10 cites·20 claims
- 4463US9588554B2Hybrid heat exchangerDELL PRODUCTS LP·Filed 2013·Granted Mar 7, 2017·1 cites·19 claims
- 4561US7353860B2Heat dissipating device with enhanced boiling/condensation structureINTEL CORP·Filed 2004·Granted Apr 8, 2008·8 cites·19 claims
- 4660US7510418B1Loading mechanisms for integrated circuit (IC) packagesINTEL CORP·Filed 2007·Granted Mar 31, 2009·7 cites·7 claims
- 4758US7082031B2Heatsink device and methodINTEL CORP·Filed 2003·Granted Jul 25, 2006·7 cites·26 claims
- 4856US6967840B2Clearing of vapor lock in a microchannel cooling subsystemINTEL CORP·Filed 2004·Granted Nov 22, 2005·6 cites·26 claims
- 4954US2010047092A1Piezoelectric fan, method of cooling a microelectronic device using same, and system containing sameERTURK HAKAN·Filed 2009·Application pending·0 cites
- 5052US2009084931A1Enabling bare die liquid cooling for the bare die and hot spotsINTEL CORP·Filed 2007·Application pending·0 cites
Showing the top 50 of 71 patent records by PatentIndex Score.
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