Inventor · disambiguated record
Te-Chang Huang
Also filed as: HUANG TE-CHANG
8 granted patents·7 pending applications·144 citations·filing 2002–2010
87Inventor score
Files withJOHNSON HEALTH TECH CO LTD7COMPEQ MFG CO LTD2LIN CHENG-YUAN2JOHNSON TECH CO LTD1LIAO HUNG MAO1
Top patents by PatentIndex Score
15 records- 0190US7316633B2Elliptical exercise machineJOHNSON HEALTH TECH CO LTD·Filed 2004·Granted Jan 8, 2008·74 cites·6 claims
- 0288US6979636B1Method for forming heightened solder bumps on circuit boardsCOMPEQ MFG CO LTD·Filed 2005·Granted Dec 27, 2005·23 cites·5 claims
- 0385US7854691B2Exercise apparatusJOHNSON HEALTH TECH CO LTD·Filed 2010·Granted Dec 21, 2010·20 cites·19 claims
- 0473US7632220B2Exercise apparatusJOHNSON HEALTH TECH CO LTD·Filed 2009·Granted Dec 15, 2009·11 cites·7 claims
- 0568US7530930B2Exercise apparatusJOHNSON HEALTH TECH CO LTD·Filed 2006·Granted May 12, 2009·6 cites·9 claims
- 0667US7704193B2Exercise apparatusJOHNSON HEALTH TECH CO LTD·Filed 2009·Granted Apr 27, 2010·5 cites·8 claims
- 0758US9547839B2Method and system utilizing user-state-monitoring objects and relevant data to monitor and provide customer service onlineLUO VICKY W·Filed 2010·Granted Jan 17, 2017·4 cites·20 claims
- 0853US2009163327A1Folding treadmillJOHNSON HEALTH TECH CO LTD·Filed 2009·Application pending·0 cites
- 0952US2008167165A1Elliptical exercise machineJOHNSON HEALTH TECH CO LTD·Filed 2007·Application pending·0 cites
- 1046US2006166791A1Elliptical exercise machine with adjustable elliptical pathLIAO HUNG-MAO·Filed 2005·Application pending·0 cites
- 1145US2006003869A1Folding treadmillJOHNSON TECH CO LTD·Filed 2004·Application pending·0 cites
- 1242US6675704B2Solder paste stenciling apparatus for minimizing residue of solder pasteCOMPEQ MFG CO LTD·Filed 2002·Granted Jan 13, 2004·1 cites·8 claims
- 1333US2003178466A1Solder paste stenciling apparatus for minimizing residue of solder pasteFiled 2002·Application pending·0 cites
- 1432US2006094225A1Methods for forming solder bumps on circuit boardsLIN CHENG-YUAN·Filed 2004·Application pending·0 cites
- 1532US2006099790A1Method of implanting at least one solder bump on a printed circuit boardLIN CHENG-YUAN·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Te-Chang Huang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →