Assignee
LIN CHENG-YUAN
TW·1 granted patent·2 pending applications·0 citations·filing 2004–2011
Top patents by PatentIndex Score
3 records- 0132US2006094225A1Methods for forming solder bumps on circuit boardsLIN CHENG-YUAN·Filed 2004·Application pending·0 cites
- 0232US2006099790A1Method of implanting at least one solder bump on a printed circuit boardLIN CHENG-YUAN·Filed 2004·Application pending·0 cites
- 0329US8706493B2Controllable prosody re-estimation system and method and computer program product thereofLIN CHENG-YUAN·Filed 2011·Granted Apr 22, 2014·0 cites·25 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →