Inventor · disambiguated record
Ramin Emami
Also filed as: EMAMI RAMIN · SCALES MARTY
21 granted patents·7 pending applications·548 citations·filing 1998–2006
96Inventor score
Top patents by PatentIndex Score
28 records- 0194US6413873B1System for chemical mechanical planarizationAPPLIED MATERIALS INC·Filed 2000·Granted Jul 2, 2002·85 cites·3 claims
- 0291US6676497B1Vibration damping in a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2000·Granted Jan 13, 2004·33 cites·9 claims
- 0388US7256111B2Pretreatment for electroless depositionAPPLIED MATERIALS INC·Filed 2004·Granted Aug 14, 2007·40 cites·19 claims
- 0488US6857941B2Multi-phase polishing padAPPLIED MATERIALS INC·Filed 2002·Granted Feb 22, 2005·34 cites·6 claims
- 0588US6669538B2Pad cleaning for a CMP systemAPPLIED MATERIALS INC·Filed 2000·Granted Dec 30, 2003·32 cites·7 claims
- 0686US7273813B2Wafer cleaning solution for cobalt electroless applicationAPPLIED MATERIALS INC·Filed 2005·Granted Sep 25, 2007·11 cites·12 claims
- 0786US6786996B2Apparatus and method for edge bead removalAPPLIED MATERIALS INC·Filed 2001·Granted Sep 7, 2004·35 cites·21 claims
- 0885US6299698B1Wafer edge scrubber and methodAPPLIED MATERIALS INC·Filed 1998·Granted Oct 9, 2001·75 cites·30 claims
- 0982US7014538B2Article for polishing semiconductor substratesAPPLIED MATERIALS INC·Filed 2003·Granted Mar 21, 2006·27 cites·32 claims
- 1080US7497767B2Vibration damping during chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Mar 3, 2009·8 cites·3 claims
- 1176US6592439B1Platen for retaining polishing materialAPPLIED MATERIALS INC·Filed 2000·Granted Jul 15, 2003·22 cites·43 claims
- 1275US6322427B1Conditioning fixed abrasive articlesAPPLIED MATERIALS INC·Filed 1999·Granted Nov 27, 2001·35 cites·45 claims
- 1373US6656842B2Barrier layer buffing after Cu CMPAPPLIED MATERIALS INC·Filed 1999·Granted Dec 2, 2003·41 cites·16 claims
- 1473US6432826B1Planarized Cu cleaning for reduced defectsAPPLIED MATERIALS INC·Filed 1999·Granted Aug 13, 2002·35 cites·30 claims
- 1570US8133096B2Multi-phase polishing padEMAMI RAMIN·Filed 2005·Granted Mar 13, 2012·6 cites·23 claims
- 1668US6708701B2Capillary ringAPPLIED MATERIALS INC·Filed 2001·Granted Mar 23, 2004·11 cites·32 claims
- 1753US7104267B2Planarized copper cleaning for reduced defectsAPPLIED MATERIALS INC·Filed 2000·Granted Sep 12, 2006·3 cites·54 claims
- 1851US7041599B1High through-put Cu CMP with significantly reduced erosion and dishingAPPLIED MATERIALS INC·Filed 1999·Granted May 9, 2006·14 cites·26 claims
- 1950US7331847B2Vibration damping in chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2006·Granted Feb 19, 2008·0 cites·6 claims
- 2044US2003201185A1In-situ pre-clean for electroplating processAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 2142US7014545B2Vibration damping in a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 2004·Granted Mar 21, 2006·0 cites·23 claims
- 2240US2001004538A1High through-put copper CMP with reduced erosion and dishingAPPLIED MATERIALS INC·Filed 2000·Application pending·0 cites
- 2339US2005170650A1Electroless palladium nitrate activation prior to cobalt-alloy depositionFiled 2004·Application pending·0 cites
- 2439US2005161338A1Electroless cobalt alloy deposition processAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 2536US2003070695A1N2 splash guard for liquid injection on the rotating substrateAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 2636US2003150734A1Electroplating solution composition controlAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 2736US2003073320A1Method for preventing surface corrosion in an edge bead removal processAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 2831US6832948B1Thermal preconditioning fixed abrasive articlesAPPLIED MATERIALS INC·Filed 1999·Granted Dec 21, 2004·1 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →