Inventor · disambiguated record
Xue Yang Chang
Also filed as: CHANG XUE · Chang xue yang
16 granted patents·9 pending applications·45 citations·filing 2017–2024
89Inventor score
Files withAPPLIED MATERIALS INC25
Top patents by PatentIndex Score
25 records- 0195US12020977B2Lift pin assemblyAPPLIED MATERIALS INC·Filed 2022·Granted Jun 25, 2024·4 cites·20 claims
- 0294USD1049067SRing for an anti-rotation process kit for a substrate processing chamberAPPLIED MATERIALS INC·Filed 2022·Granted Oct 29, 2024·24 cites·1 claims
- 0386US12341048B2Porous plug for electrostatic chuck gas deliveryAPPLIED MATERIALS INC·Filed 2021·Granted Jun 24, 2025·1 cites·20 claims
- 0485USD1066275SBaffle for anti-rotation process kit for substrate processing chamberAPPLIED MATERIALS INC·Filed 2022·Granted Mar 11, 2025·10 cites·1 claims
- 0585US10381200B2Plasma chamber with tandem processing regionsAPPLIED MATERIALS INC·Filed 2017·Granted Aug 13, 2019·3 cites·20 claims
- 0676US2025069921A1In-situ semiconductor processing chamber temperature apparatusAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0769US11211282B2Apparatus to reduce contamination in a plasma etching chamberAPPLIED MATERIALS INC·Filed 2018·Granted Dec 28, 2021·1 cites·16 claims
- 0869US11069547B2In-situ temperature measurement for inside of process chamberAPPLIED MATERIALS INC·Filed 2018·Granted Jul 20, 2021·1 cites·17 claims
- 0968US12183605B2In-situ semiconductor processing chamber temperature apparatusAPPLIED MATERIALS INC·Filed 2021·Granted Dec 31, 2024·0 cites·17 claims
- 1068US11199267B2Symmetric flow valve for higher flow conductanceAPPLIED MATERIALS INC·Filed 2019·Granted Dec 14, 2021·1 cites·17 claims
- 1164US10847351B2Plasma chamber with tandem processing regionsAPPLIED MATERIALS INC·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 1262US11835146B2Symmetric flow valve for flow conductance controlAPPLIED MATERIALS INC·Filed 2021·Granted Dec 5, 2023·0 cites·19 claims
- 1361US12198903B2Plasma resistant arc preventative coatings for manufacturing equipment componentsAPPLIED MATERIALS INC·Filed 2021·Granted Jan 14, 2025·0 cites·20 claims
- 1458US2024420984A1Electrostatic substrate supportAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1557US2024420932A1Substrate supportAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1655US12211734B2Lift pin mechanismAPPLIED MATERIALS INC·Filed 2022·Granted Jan 28, 2025·0 cites·20 claims
- 1754US2025112075A1Metal bonded esc with outer ceramic vacuum isolation ring for cryogenic serviceAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1853US2025323022A1Treatment chamber with modular microwave power deliveryAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1952US12100576B2Metal oxide preclean chamber with improved selectivity and flow conductanceAPPLIED MATERIALS INC·Filed 2020·Granted Sep 24, 2024·0 cites·20 claims
- 2052US11551965B2Apparatus to reduce polymers depositionAPPLIED MATERIALS INC·Filed 2019·Granted Jan 10, 2023·0 cites·20 claims
- 2151US10811233B2Process chamber having tunable showerhead and tunable linerAPPLIED MATERIALS INC·Filed 2017·Granted Oct 20, 2020·0 cites·18 claims
- 2251US2018366354A1In-situ semiconductor processing chamber temperature apparatusAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2342US2018046206A1Method and apparatus for controlling gas flow to a process chamberAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 2441US2019341233A1Semiconductor substrate processing apparatus and methodAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2537US2018047542A1Inductively coupled plasma chamber having a multi-zone showerheadAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →