Inventor · disambiguated record
Robert P. Mandal
Also filed as: MANDAL ROBERT · MANDAL ROBERT P · MANDAL ROBERT PARKASH
42 granted patents·1 pending application·3,074 citations·filing 1974–2009
99Inventor score
Files withAPPLIED MATERIALS INC29ASML HOLDING NV4AIR PROD & CHEM3SILICON VALLEY GROUP3ASML NETHERLANDS BV2
Top patents by PatentIndex Score
43 records- 0199US6596627B2Very low dielectric constant plasma-enhanced CVD filmsAPPLIED MATERIALS INC·Filed 2002·Granted Jul 22, 2003·92 cites·21 claims
- 0299US6541367B1Very low dielectric constant plasma-enhanced CVD filmsAPPLIED MATERIALS INC·Filed 2000·Granted Apr 1, 2003·156 cites·30 claims
- 0399US6303523B2Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 1998·Granted Oct 16, 2001·751 cites·53 claims
- 0498US7825042B2Very low dielectric constant plasma-enhanced CVD filmsAPPLIED MATERIALS INC·Filed 2009·Granted Nov 2, 2010·33 cites·12 claims
- 0598US3986255AProcess for electrically interconnecting chips with substrates employing gold alloy bumps and magnetic materials thereinITEK CORP·Filed 1974·Granted Oct 19, 1976·103 cites·15 claims
- 0697US6562690B1Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2000·Granted May 13, 2003·102 cites·26 claims
- 0797US6448187B2Method of improving moisture resistance of low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2001·Granted Sep 10, 2002·98 cites·30 claims
- 0897US6348725B2Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 1999·Granted Feb 19, 2002·161 cites·38 claims
- 0997US6171945B1CVD nanoporous silica low dielectric constant filmsAPPLIED MATERIALS INC·Filed 1998·Granted Jan 9, 2001·317 cites·43 claims
- 1096US6734115B2Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2002·Granted May 11, 2004·67 cites·12 claims
- 1196US6660656B2Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2001·Granted Dec 9, 2003·111 cites·11 claims
- 1296US6596655B1Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2001·Granted Jul 22, 2003·77 cites·20 claims
- 1396US6559070B1Mesoporous silica films with mobile ion gettering and accelerated processingAPPLIED MATERIALS INC·Filed 2000·Granted May 6, 2003·107 cites·40 claims
- 1496US6541282B1Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2000·Granted Apr 1, 2003·80 cites·17 claims
- 1596US6245690B1Method of improving moisture resistance of low dielectric constant filmsAPPLIED MATERIALS INC·Filed 1998·Granted Jun 12, 2001·132 cites·20 claims
- 1695US7560377B2Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2005·Granted Jul 14, 2009·19 cites·16 claims
- 1793US6743737B2Method of improving moisture resistance of low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2002·Granted Jun 1, 2004·39 cites·29 claims
- 1892US6869896B2Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2003·Granted Mar 22, 2005·37 cites·16 claims
- 1991US6770424B2Wafer track apparatus and methods for dispensing fluids with rotatable dispense armsASML HOLDING NV·Filed 2002·Granted Aug 3, 2004·54 cites·30 claims
- 2089US7205224B2Very low dielectric constant plasma-enhanced CVD filmsAPPLIED MATERIALS INC·Filed 2003·Granted Apr 17, 2007·21 cites·18 claims
- 2189US6592980B1Mesoporous films having reduced dielectric constantsAIR PROD & CHEM·Filed 2000·Granted Jul 15, 2003·39 cites·6 claims
- 2288US5670210AMethod of uniformly coating a substrateSILICON VALLEY GROUP·Filed 1995·Granted Sep 23, 1997·91 cites·4 claims
- 2387US6930061B2Plasma processes for depositing low dielectric constant filmsAPPLIED MATERIALS INC·Filed 2003·Granted Aug 16, 2005·32 cites·25 claims
- 2487US6890639B2Very low dielectric constant plasma-enhanced CVD filmsAPPLIED MATERIALS INC·Filed 2002·Granted May 10, 2005·16 cites·25 claims
- 2587US6013315ADispense nozzle design and dispense methodAPPLIED MATERIALS INC·Filed 1998·Granted Jan 11, 2000·44 cites·30 claims
- 2686US7633163B2Very low dielectric constant plasma-enhanced CVD filmsAPPLIED MATERIALS INC·Filed 2006·Granted Dec 15, 2009·3 cites·3 claims
- 2785US6576568B2Ionic additives for extreme low dielectric constant chemical formulationsAPPLIED MATERIALS INC·Filed 2001·Granted Jun 10, 2003·29 cites·15 claims
- 2884US7094710B2Very low dielectric constant plasma-enhanced CVD filmsAPPLIED MATERIALS INC·Filed 2004·Granted Aug 22, 2006·14 cites·20 claims
- 2979US7601631B2Very low dielectric constant plasma-enhanced CVD filmsAPPPLIED MATERIALS INC·Filed 2006·Granted Oct 13, 2009·5 cites·6 claims
- 3079US6107184ANano-porous copolymer films having low dielectric constantsAPPLIED MATERIALS INC·Filed 1998·Granted Aug 22, 2000·52 cites·11 claims
- 3178US7399697B2Very low dielectric constant plasma-enhanced CVD filmsAPPLIED MATERIALS INC·Filed 2004·Granted Jul 15, 2008·10 cites·20 claims
- 3278US6362115B1In-situ generation of p-xylyiene from liquid precursorsAPPLIED MATERIALS INC·Filed 1998·Granted Mar 26, 2002·28 cites·2 claims
- 3377US6818289B2Mesoporous films having reduced dielectric constantsAIR PROD & CHEM·Filed 2002·Granted Nov 16, 2004·17 cites·11 claims
- 3475US7012030B2Very low dielectric constant plasma-enhanced CVD filmsAPPLIED MATERIALS INC·Filed 2004·Granted Mar 14, 2006·8 cites·20 claims
- 3575US6896955B2Ionic additives for extreme low dielectric constant chemical formulationsAPPLIED MATERIALS INC·Filed 2002·Granted May 24, 2005·16 cites·20 claims
- 3675US6238735B1Method of uniformly coating a substrateSILICON VALLEY GROUP·Filed 1999·Granted May 29, 2001·38 cites·30 claims
- 3773US6977098B2Method of uniformly coating a substrateASML HOLDING NV·Filed 2001·Granted Dec 20, 2005·17 cites·5 claims
- 3869US5954878AApparatus for uniformly coating a substrateSILICON VALLEY GROUP·Filed 1997·Granted Sep 21, 1999·31 cites·3 claims
- 3966US7030039B2Method of uniformly coating a substrateASML HOLDING NV·Filed 2001·Granted Apr 18, 2006·11 cites·32 claims
- 4058US7265062B2Ionic additives for extreme low dielectric constant chemical formulationsAIR PROD & CHEM·Filed 2003·Granted Sep 4, 2007·6 cites·13 claims
- 4157US6891134B2Integrally formed bake plate unit for use in wafer fabrication systemASML NETHERLANDS BV·Filed 2003·Granted May 10, 2005·5 cites·19 claims
- 4254US7018943B2Method of uniformly coating a substrateASML HOLDING NV·Filed 2001·Granted Mar 28, 2006·5 cites·85 claims
- 4338US2004157430A1Methods and apparatus for processing semiconductor wafers with plasma processing chambers in a wafer track environmentASML NETHERLANDS BV·Filed 2003·Application pending·0 cites
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