Inventor · disambiguated record
Chau-Chun Wen
Also filed as: WEN CHAU C · WEN CHAU-CHUN
19 granted patents·7 pending applications·183 citations·filing 1995–2020
94Inventor score
Files withCYNTEC CO LTD13CHEN DA-JUNG4DELTA ELECTRONICS INC3UBIQ SEMICONDUCTOR CORP2DELTA ELECTRONIC INC1
Top patents by PatentIndex Score
26 records- 0190US8338933B2Three-dimensional package structureCHEN DA-JUNG·Filed 2011·Granted Dec 25, 2012·11 cites·9 claims
- 0287US6388897B1DC-to-DC converter and method for converting direct current to direct currentDELTA ELECTRONICS INC·Filed 2001·Granted May 14, 2002·67 cites·25 claims
- 0385US7411278B2Package device with electromagnetic interference shieldCYNTEC CO LTD·Filed 2006·Granted Aug 12, 2008·17 cites·26 claims
- 0485US7405467B2Power module package structureCYNTEC CO LTD·Filed 2005·Granted Jul 29, 2008·15 cites·25 claims
- 0584US8837168B2Electronic package structureCYNTEC CO LTD·Filed 2013·Granted Sep 16, 2014·5 cites·15 claims
- 0683US8824165B2Electronic package structureCHEN DA-JUNG·Filed 2011·Granted Sep 2, 2014·7 cites·20 claims
- 0779US8338928B2Three-dimensional package structureCHEN DA-JUNG·Filed 2007·Granted Dec 25, 2012·7 cites·22 claims
- 0878US9184672B2DC to AC power conversion with resonance valley detectionIND TECH RES INST·Filed 2013·Granted Nov 10, 2015·5 cites·16 claims
- 0975US9741708B2Transient voltage suppressor and ESD protection device and array thereofUBIQ SEMICONDUCTOR CORP·Filed 2015·Granted Aug 22, 2017·2 cites·16 claims
- 1075US8247891B2Chip package structure including heat dissipation device and an insulation sheetWEN CHAU-CHUN·Filed 2009·Granted Aug 21, 2012·9 cites·19 claims
- 1172US7982304B2Chip package structureCYNTEC CO LTD·Filed 2009·Granted Jul 19, 2011·5 cites·12 claims
- 1269US7551455B2Package structureCYNTEC CO LTD·Filed 2006·Granted Jun 23, 2009·5 cites·14 claims
- 1367US10991681B2Three-dimensional package structureCYNTEC CO LTD·Filed 2020·Granted Apr 27, 2021·0 cites·10 claims
- 1467US6483726B2Auxiliary output voltage control circuit of flyback power converter with a magnetic amplifierDELTA ELECTRONICS INC·Filed 2001·Granted Nov 19, 2002·21 cites·16 claims
- 1558US9443809B2Portable apparatus, IC packaging structure, IC packaging object, and IC packaging method thereofUPI SEMICONDUCTOR CORP·Filed 2015·Granted Sep 13, 2016·1 cites·14 claims
- 1656US10593656B2Three-dimensional package structureCYNTEC CO LTD·Filed 2017·Granted Mar 17, 2020·0 cites·5 claims
- 1753US9601412B2Three-dimensional package structureCHEN DA-JUNG·Filed 2012·Granted Mar 21, 2017·0 cites·17 claims
- 1852US2009207574A1Electronic package structureCYNTEC CO LTD·Filed 2008·Application pending·0 cites
- 1948US2011090648A1Electronic package structureCYNTEC CO LTD·Filed 2010·Application pending·0 cites
- 2045US2008179722A1Electronic package structureCYNTEC CO LTD·Filed 2007·Application pending·0 cites
- 2144US2008180921A1Electronic package structureCYNTEC CO LTD·Filed 2007·Application pending·0 cites
- 2241US6490184B2Auxiliary output voltage control implemented with a bi-directionally magnetizing magnetic amplifierDELTA ELECTRONICS INC·Filed 2001·Granted Dec 3, 2002·4 cites·25 claims
- 2340US2006284340A1Method for preventing the overflowing of molding compound during fabricating package deviceCYNTEC CO LTD·Filed 2005·Application pending·0 cites
- 2440US2006220188A1Package structure having mixed circuit and composite substrateCYNTEC CO LTD·Filed 2005·Application pending·0 cites
- 2533US2016099198A1Semiconductor package apparatusUBIQ SEMICONDUCTOR CORP·Filed 2015·Application pending·0 cites
- 2630US5682302AAdaptable power converter applying digitized-wave-generation for integrated circuit implementationDELTA ELECTRONIC INC·Filed 1995·Granted Oct 28, 1997·2 cites·4 claims
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