Electronic package structure

Abstract

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

1 . An electronic package structure, comprising:
 at least one first electronic element;   a second electronic element, comprising a body having a cavity, wherein the first electronic element is disposed in the cavity; and   a first lead frame, having a plurality of leads, wherein each of the leads has a first end and second end, and the first end of at least one of the leads extends to the cavity for electrically connecting to the first electronic element.   
   
   
       2 . The electronic package structure as claimed in  claim 1 , further comprising a circuit substrate disposed in the cavity, wherein the first electronic element is disposed on the circuit substrate and electrically connected to the circuit substrate, and the circuit substrate is electrically connected to the first end of the lead extending to the cavity. 
   
   
       3 . The electronic package structure as claimed in  claim 1 , wherein the body has a first surface and a second surface opposite to the first surface, the cavity sinks in a direction from the first surface towards the second surface, and the second end of each of the leads is disposed on the first surface. 
   
   
       4 . The electronic package structure as claimed in  claim 1 , wherein the body has a first surface and a second surface opposite to the first surface, the cavity sinks in a direction from the second surface towards the first surface, and the second end of each of the leads is disposed on the first surface. 
   
   
       5 . The electronic package structure as claimed in  claim 1 , wherein the body has a first surface, a second surface opposite to the first surface and a side surface, the side surface connects the first surface and the second surface, and a part of each of the leads connecting the first end and the second end is disposed on the side surface. 
   
   
       6 . The electronic package structure as claimed in  claim 1 , wherein a part of each of the leads connecting the first end and the second end penetrates the body. 
   
   
       7 . The electronic package structure as claimed in  claim 1 , wherein the first end of each of the leads is embedded in the body. 
   
   
       8 . The electronic package structure as claimed in  claim 1 , further comprising an insulating encapsulant disposed in the cavity and encapsulating the first electronic element. 
   
   
       9 . The electronic package structure as claimed in  claim 1 , wherein the second electronic element is an inductive element further comprising a coil, and the body is a magnetic body enclosing the coil. 
   
   
       10 . The electronic package structure as claimed in  claim 9 , further comprising a magnetic encapsulant disposed in the cavity and encapsulating the first electronic element. 
   
   
       11 . The electronic package structure as claimed in  claim 1 , wherein the first electronic element is a control element or a power element, the second electronic element is an energy-storage element, and the size of the second electronic element is greater than the first electronic element. 
   
   
       12 . The electronic package structure as claimed in  claim 1 , wherein the second electronic element further comprises a plurality of first external electrodes disposed on a first surface of the body, and the second end of each of the leads is disposed on the first surface to form a second external electrode. 
   
   
       13 . The electronic package structure as claimed in  claim 1 , further comprising a second lead frame disposed in the cavity, wherein the first electronic element is disposed on the second lead frame and electrically connected to the second lead frame, and the second lead frame is electrically connected to the first end of the lead extending to the cavity.