Electronic package structure

Abstract

An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

1 - 13 . (canceled) 
     
     
         14 . An electronic package, comprising:
 a substrate;   at least an electronic element on top of the substrate;   a coil;   a body encapsulating at least said coil and being positioned on top of said electronic element; and   a pair of leads each having
 a top end electrically coupled to a respective end of the coil, 
 a bottom end electrically coupled to the substrate, and 
 a middle section connecting said top end and said bottom end to define a bracket shape. 
   
     
     
         15 . An electronic package as claimed in  claim 14 , wherein the electronic element is disposed on a top face of the substrate between the bottom ends of the leads. 
     
     
         16 . An electronic package as claimed in  claim 14 , wherein said middle section of each said lead is entirely exposed out of said body. 
     
     
         17 . An electronic package as claimed in  claim 14 , wherein said top end of each said lead is at least partially embedded in the body. 
     
     
         18 . An electronic package as claimed in  claim 14 , wherein said substrate includes
 first and second conductive layers on opposite top and bottom faces of said substrate; and   at least one conductive via penetrating the substrate to electrically connect the first and second conductive layers;   wherein said conductive via is disposed immediately under the electronic element for dissipating heat generated by said electronic element away.   
     
     
         19 . An electronic package as claimed in  claim 14 , further comprising:
 an insulating encapsulant encapsulating the electronic element and disposed under the body.   
     
     
         20 . An electronic package as claimed in  claim 19 , wherein a width of said encapsulant is smaller than that of said body. 
     
     
         21 . An electronic package as claimed in  claim 20 , wherein said encapsulant is disposed between the bottom ends of the leads. 
     
     
         22 . An electronic package as claimed in  claim 14 , wherein the top end and bottom end of each said lead are positioned in parallel planes and the middle section of said lead is perpendicular to the top end and the bottom end. 
     
     
         23 . An electronic package as claimed in  claim 14 , wherein said electronic element is one selected from the group consisting of a capacitor, a resistor, and an inductor with a smaller inductance than the coil. 
     
     
         24 . An electronic package as claimed in  claim 14 , wherein said electronic element is one selected from the group consisting of a metal-oxide-semiconductor field effect transistor (MOSFET), an insulated gate bipolar transistor (IGBT), and a diode. 
     
     
         25 . An electronic package as claimed in  claim 14 , comprising multiple said electronic elements disposed under the body and between the bottom ends of the leads. 
     
     
         26 . An electronic package as claimed in  claim 14 , further comprising:
 an electromagnetic-interference (EMI) shielding element between the coil and the electronic element.   
     
     
         27 . An electronic package as claimed in  claim 26 , further comprising
 an insulating encapsulant encapsulating the electronic element and disposed under the body;   wherein the EMI shielding element is embedded in the encapsulant.   
     
     
         28 . An electronic package as claimed in  claim 26 , wherein the EMI shielding element is embedded in the body. 
     
     
         29 . An electronic package as claimed in  claim 28 , wherein the body includes a magnetic wrap that wraps the coil.