Inventor · disambiguated record
Robert L. Hubbard
Also filed as: HUBBARD ROBERT · HUBBARD ROBERT L
14 granted patents·3 pending applications·291 citations·filing 1978–2019
92Inventor score
Top patents by PatentIndex Score
17 records- 0192US6991961B2Method of forming a high-voltage/high-power die packageMEDTRONIC INC·Filed 2003·Granted Jan 31, 2006·88 cites·24 claims
- 0288USD292345SSockAMERICAL CORP·Filed 1984·Granted Oct 20, 1987·25 cites·1 claims
- 0385US4306526AInternal combustion engineCOOPER IND INC·Filed 1978·Granted Dec 22, 1981·50 cites·15 claims
- 0480US6051887ASemiconductor stacked device for implantable medical apparatusMEDTRONIC INC·Filed 1998·Granted Apr 18, 2000·55 cites·37 claims
- 0579USD305384SSockAMERICAL CORP·Filed 1987·Granted Jan 9, 1990·18 cites·1 claims
- 0677US9519221B2Method for microwave processing of photosensitive polyimidesAPPLIED MATERIALS INC·Filed 2015·Granted Dec 13, 2016·2 cites·16 claims
- 0773US6168973B1Semiconductor stacked device for implantable medical apparatus and method for making sameMEDTRONIC INC·Filed 1999·Granted Jan 2, 2001·41 cites·23 claims
- 0859US7045390B2Stacked die packageMEDTRONIC INC·Filed 2003·Granted May 16, 2006·5 cites·22 claims
- 0956US10854525B2Method of curing thermoplastics with microwave energyAPPLIED MATERIALS INC·Filed 2019·Granted Dec 1, 2020·0 cites·8 claims
- 1056US2019378713A1Method for lower thermal budget multiple cures in semiconductor packagingAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 1155US10139728B2Method for microwave processing of photosensitive polyimidesAPPLIED MATERIALS INC·Filed 2016·Granted Nov 27, 2018·0 cites·14 claims
- 1252US10224258B2Method of curing thermoplastics with microwave energyAPPLIED MATERIALS INC·Filed 2013·Granted Mar 5, 2019·0 cites·22 claims
- 1348US2013299953A1Method for lower thermal budget multiple cures in semiconductor packagingHUBBARD ROBERT L·Filed 2012·Application pending·0 cites
- 1443US7901536B2Resonating conductive traces and methods of using same for bonding componentsLAMBDA TECHNOLOGIES INC·Filed 2007·Granted Mar 8, 2011·0 cites·17 claims
- 1541US9508616B2Method for lower thermal budget multiple cures in semiconductor packagingAHMAD IFTIKHAR·Filed 2012·Granted Nov 29, 2016·0 cites·13 claims
- 1639US4729639ADual frequency addressable liquid crystals and methods of useTEKTRONIX INC·Filed 1984·Granted Mar 8, 1988·7 cites·13 claims
- 1739US2002121693A1Stacked die packageFiled 2000·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →