Inventor · disambiguated record
Sergio Fukuda Shoji
Also filed as: SHOJI SERGIO · SHOJI SERGIO F · SHOJI SERGIO FUKUDA
27 granted patents·6 pending applications·315 citations·filing 1995–2020
96Inventor score
Files withAPPLIED MATERIALS INC26MAHADESWARASWAMY CHETAN2LIAO BRYAN1MERRY WALTER R1SMC PNEUMATICS INC1
Top patents by PatentIndex Score
33 records- 0197US9788405B2RF power delivery with approximated saw tooth wave pulsingAPPLIED MATERIALS INC·Filed 2015·Granted Oct 10, 2017·47 cites·20 claims
- 0296US8962488B2Synchronized radio frequency pulsing for plasma etchingAPPLIED MATERIALS INC·Filed 2013·Granted Feb 24, 2015·30 cites·15 claims
- 0395US10378108B2Showerhead with reduced backside plasma ignitionAPPLIED MATERIALS INC·Filed 2016·Granted Aug 13, 2019·6 cites·20 claims
- 0494US8513889B2Methods and apparatus for tuning matching networksZHANG CHUNLEI·Filed 2010·Granted Aug 20, 2013·56 cites·20 claims
- 0594US8404598B2Synchronized radio frequency pulsing for plasma etchingLIAO BRYAN·Filed 2010·Granted Mar 26, 2013·77 cites·20 claims
- 0692US10745807B2Showerhead with reduced backside plasma ignitionAPPLIED MATERIALS INC·Filed 2019·Granted Aug 18, 2020·3 cites·20 claims
- 0791US8880227B2Component temperature control by coolant flow control and heater duty cycle controlMAHADESWARASWAMY CHETAN·Filed 2011·Granted Nov 4, 2014·11 cites·21 claims
- 0887US9741539B2RF power delivery regulation for processing substratesAPPLIED MATERIALS INC·Filed 2015·Granted Aug 22, 2017·4 cites·15 claims
- 0987US9269587B2Methods for etching materials using synchronized RF pulsesAPPLIED MATERIALS INC·Filed 2013·Granted Feb 23, 2016·8 cites·19 claims
- 1086US9909213B2Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactorsAPPLIED MATERIALS INC·Filed 2014·Granted Mar 6, 2018·3 cites·19 claims
- 1182US9338871B2Feedforward temperature control for plasma processing apparatusMAHADESWARASWAMY CHETAN·Filed 2010·Granted May 10, 2016·5 cites·14 claims
- 1281US10242893B2Method and apparatus for de-chucking a workpiece using a swing voltage sequenceAPPLIED MATERIALS INC·Filed 2017·Granted Mar 26, 2019·2 cites·12 claims
- 1380US10504765B2Electrostatic chuck assembly having a dielectric fillerAPPLIED MATERIALS INC·Filed 2017·Granted Dec 10, 2019·2 cites·20 claims
- 1474US10468233B2RF power delivery regulation for processing substratesAPPLIED MATERIALS INC·Filed 2017·Granted Nov 5, 2019·1 cites·20 claims
- 1573US10490429B2Substrate carrier using a proportional thermal fluid delivery systemAPPLIED MATERIALS INC·Filed 2014·Granted Nov 26, 2019·2 cites·14 claims
- 1671US10854427B2Radio frequency (RF) pulsing impedance tuning with multiplier modeAPPLIED MATERIALS INC·Filed 2018·Granted Dec 1, 2020·1 cites·20 claims
- 1771US10546731B1Method, apparatus and system for wafer dechucking using dynamic voltage sweepingAPPLIED MATERIALS INC·Filed 2018·Granted Jan 28, 2020·1 cites·20 claims
- 1869US10854425B2Feedforward temperature control for plasma processing apparatusAPPLIED MATERIALS INC·Filed 2016·Granted Dec 1, 2020·1 cites·8 claims
- 1967US2018142354A1Recursive pumping for symmetrical gas exhaust to control critical dimension uniformity in plasma reactorsAPPLIED MATERIALS INC·Filed 2018·Application pending·0 cites
- 2063US10930540B2Electrostatic chuck assembly having a dielectric fillerAPPLIED MATERIALS INC·Filed 2019·Granted Feb 23, 2021·0 cites·9 claims
- 2162US6898065B2Method and apparatus for operating an electrostatic chuck in a semiconductor substrate processing systemFiled 2002·Granted May 24, 2005·8 cites·7 claims
- 2260US11615973B2Substrate carrier using a proportional thermal fluid delivery systemAPPLIED MATERIALS INC·Filed 2019·Granted Mar 28, 2023·0 cites·7 claims
- 2360US10784132B2Method and apparatus for de-chucking a workpiece using a swing voltage sequenceAPPLIED MATERIALS INC·Filed 2019·Granted Sep 22, 2020·0 cites·13 claims
- 2459US2020066493A1Methods and apparatus for plasma liners with high fluid conductanceAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2557US9639097B2Component temperature control by coolant flow control and heater duty cycle controlAPPLIED MATERIALS INC·Filed 2014·Granted May 2, 2017·0 cites·15 claims
- 2656US11171030B2Methods and apparatus for dechucking wafersAPPLIED MATERIALS INC·Filed 2019·Granted Nov 9, 2021·0 cites·20 claims
- 2753US5721737ASerial transmission system for controlling a network of I/O devicesSMC PNEUMATICS INC·Filed 1995·Granted Feb 24, 1998·47 cites·20 claims
- 2850US2014224767A1Automated algorithm for tuning of feedforward control parameters in plasma processing systemMERRY WALTER R·Filed 2014·Application pending·0 cites
- 2945US12476081B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2020·Granted Nov 18, 2025·0 cites·6 claims
- 3045US2020411355A1Apparatus for reduction or prevention of arcing in a substrate supportAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 3143US12467139B2Multizone flow distribution systemAPPLIED MATERIALS INC·Filed 2019·Granted Nov 11, 2025·0 cites·16 claims
- 3242US2014342570A1Etch process having adaptive control with etch depth of pressure and powerAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 3337US2004031699A1Method for performing real time arcing detectionAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →