Inventor · disambiguated record
Cheol Ho Heo
Also filed as: HEO CHEOL HO
4 granted patents·15 pending applications·4 citations·filing 2008–2014
62Inventor score
Top patents by PatentIndex Score
19 records- 0169US8368291B2Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrateSAMSUNG ELECTRO MECH·Filed 2010·Granted Feb 5, 2013·3 cites·8 claims
- 0253US8624123B2Printed circuit boardHEO CHEOL HO·Filed 2011·Granted Jan 7, 2014·1 cites·6 claims
- 0353US8568861B2Metallic laminate and manufacturing method of light emitting diode package using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Oct 29, 2013·0 cites·1 claims
- 0452US2013139383A1Printed Circuit Board and Method Of Manufacturing The SameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 0548US2011266038A1Printed circuit board adn method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 0647US2009277679A1Method of manufacturing PCB and PCB manufactured by the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0747US2009133920A1Printed circuit board and manufacturing method of the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0846US2008277146A1Radiant heat printed circuit board and method of fabricating the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 0946US2011101406A1Light emitting device package and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1044US2015017477A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1141US2011316035A1Heat dissipating substrate and method of manufacturing the sameSHIN SANG HYUN·Filed 2010·Application pending·0 cites
- 1241US2012085574A1Heat radiating substrate and method of manufacturing the samePARK JI HYUN·Filed 2011·Application pending·0 cites
- 1339US8481171B2Metallic laminate and manufacturing method of light emitting diode package using the sameCHONG MYUNG GUN·Filed 2010·Granted Jul 9, 2013·0 cites·2 claims
- 1437US2013160978A1Heat dissipating substrate and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2012·Application pending·0 cites
- 1537US2013256709A1Method of manufacturing substrate for led module and substrate for led module manufactured by the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1636US2012001544A1Light emitting module and method of manufacturing the sameKIM TAE HOON·Filed 2010·Application pending·0 cites
- 1735US2014021851A1Substrate for led module and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1830US2011100616A1Heat radiating structure and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2010·Application pending·0 cites
- 1927US2012275116A1Heat radiating substrateHEO CHEOL HO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →