Inventor · disambiguated record
Peter R. Ewer
Also filed as: EWER PETER R · EWER PETER RICHARD
18 granted patents·1 pending application·1,172 citations·filing 1987–2002
96Inventor score
Technology areasH10W
Files withINT RECTIFIER CORP19
Top patents by PatentIndex Score
19 records- 0196US5886397ACrushable bead on lead finger side surface to improve moldabilityINT RECTIFIER CORP·Filed 1997·Granted Mar 23, 1999·198 cites·7 claims
- 0295US6204554B1Surface mount semiconductor packageINT RECTIFIER CORP·Filed 1997·Granted Mar 20, 2001·213 cites·62 claims
- 0393US5977630APlural semiconductor die housed in common package with split heat sinkINT RECTIFIER CORP·Filed 1997·Granted Nov 2, 1999·308 cites·18 claims
- 0493US4965710AInsulated gate bipolar transistor power moduleINT RECTIFIER CORP·Filed 1989·Granted Oct 23, 1990·120 cites·17 claims
- 0582US6465875B2Semiconductor device package with plural pad lead frameINT RECTIFIER CORP·Filed 2001·Granted Oct 15, 2002·41 cites·10 claims
- 0680US6667547B2High current capacity semiconductor device package and lead frame with large area connection posts and modified outlineINT RECTIFIER CORP·Filed 2002·Granted Dec 23, 2003·31 cites·11 claims
- 0780US6476481B2High current capacity semiconductor device package and lead frame with large area connection posts and modified outlineINT RECTIFIER CORP·Filed 1998·Granted Nov 5, 2002·61 cites·5 claims
- 0879US6255722B1High current capacity semiconductor device housingINT RECTIFIER CORP·Filed 1999·Granted Jul 3, 2001·67 cites·7 claims
- 0972US6075286AStress clip designINT RECTIFIER CORP·Filed 1998·Granted Jun 13, 2000·40 cites·17 claims
- 1064US4853762ASemi-conductor modulesINT RECTIFIER CORP·Filed 1987·Granted Aug 1, 1989·36 cites·12 claims
- 1163US6512304B2Nickel-iron expansion contact for semiconductor dieINT RECTIFIER CORP·Filed 2001·Granted Jan 28, 2003·11 cites·24 claims
- 1262US6281096B1Chip scale packaging processINT RECTIFIER CORP·Filed 2000·Granted Aug 28, 2001·9 cites·14 claims
- 1352US6396091B2Chip scale packageINT RECTIFIER CORP·Filed 2001·Granted May 28, 2002·4 cites·5 claims
- 1446US6078098ACrushable bead on lead finger side surface to improve moldabilityINT RECTIFIER CORP·Filed 1999·Granted Jun 20, 2000·11 cites·7 claims
- 1540US6348727B1High current semiconductor device package with plastic housing and conductive tabINT RECTIFIER CORP·Filed 1999·Granted Feb 19, 2002·10 cites·18 claims
- 1639US5763949ASurface-mount semiconductor packageINT RECTIFIER CORP·Filed 1996·Granted Jun 9, 1998·7 cites·34 claims
- 1735US2002012609A1Solder composition for high temperature semiconductor deviceINT RECTIFIER CORP·Filed 2001·Application pending·0 cites
- 1832US5760472ASurface mount semiconductor packageINT RECTIFIER CORP·Filed 1996·Granted Jun 2, 1998·3 cites·16 claims
- 1927US5902959ALead frame with waffled front and rear surfacesINT RECTIFIER CORP·Filed 1997·Granted May 11, 1999·2 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →