Inventor · disambiguated record
Bernhard Lange
Also filed as: LANGE BERNHARD · LANGE BERNHARD P · LANGE BERNHARD PETER
28 granted patents·20 pending applications·365 citations·filing 1986–2023
96Inventor score
Files withTEXAS INSTRUMENTS INC32LANGE BERNHARD P6TEXAS INSTRUMENTS DEUTSCHLAND3BASF SE2GEN MOTORS CORP1
Top patents by PatentIndex Score
48 records- 0198US7578422B2Bond capillary design for ribbon wire bondingTEXAS INSTRUMENTS INC·Filed 2007·Granted Aug 25, 2009·112 cites·10 claims
- 0297US7335536B2Method for fabricating low resistance, low inductance interconnections in high current semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2005·Granted Feb 26, 2008·49 cites·14 claims
- 0397US7216794B2Bond capillary design for ribbon wire bondingTEXAS INSTRUMENTS INC·Filed 2005·Granted May 15, 2007·56 cites·2 claims
- 0495US7608484B2Non-pull back pad package with an additional solder standoffTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 27, 2009·41 cites·13 claims
- 0590US11837513B2O-ring seals for fluid sensingTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 5, 2023·2 cites·19 claims
- 0688US8884343B2System in package and method for manufacturing the sameTEXAS INSTRUMENTS DEUTSCHLAND·Filed 2013·Granted Nov 11, 2014·10 cites·15 claims
- 0787US11525820B2Manufacturing fluid sensing packagesTEXAS INSTRUMENTS INC·Filed 2019·Granted Dec 13, 2022·6 cites·34 claims
- 0887US7863098B2Flip chip package with advanced electrical and thermal properties for high current designsTEXAS INSTRUMENTS INC·Filed 2008·Granted Jan 4, 2011·13 cites·6 claims
- 0984US7741704B2Leadframe and mold compound interlock in packaged semiconductor deviceTEXAS INSTRUMENTS INC·Filed 2007·Granted Jun 22, 2010·12 cites·5 claims
- 1082US7635613B2Semiconductor device having firmly secured heat spreaderTEXAS INSTRUMENTS INC·Filed 2005·Granted Dec 22, 2009·11 cites·4 claims
- 1181US7476976B2Flip chip package with advanced electrical and thermal properties for high current designsTEXAS INSTRUMENTS INC·Filed 2006·Granted Jan 13, 2009·9 cites·12 claims
- 1280US12476155B2O-ring seals for fluid sensingTEXAS INSTRUMENTS INC·Filed 2023·Granted Nov 18, 2025·0 cites·14 claims
- 1378USRE46466EMethod for fabricating low resistance, low inductance interconnections in high current semiconductor devicesLANGE BERNHARD P·Filed 2010·Granted Jul 4, 2017·4 cites·30 claims
- 1472US9458401B2Use of substituted ureas or urethanes for improvement of the use properties of mineral and synthetic nonaqueous industrial fluidsBASF SE·Filed 2013·Granted Oct 4, 2016·1 cites·18 claims
- 1571US8232144B2Non-pull back pad package with an additional solder standoffLANGE BERNHARD P·Filed 2009·Granted Jul 31, 2012·4 cites·8 claims
- 1669US7221055B2System and method for die attach using a backside heat spreaderTEXAS INSTRUMENTS INC·Filed 2005·Granted May 22, 2007·4 cites·18 claims
- 1767US8053876B2Multi lead frame power packageTEXAS INSTRUMENTS INC·Filed 2009·Granted Nov 8, 2011·2 cites·7 claims
- 1866US8039956B2High current semiconductor device system having low resistance and inductanceTEXAS INSTRUMENTS INC·Filed 2005·Granted Oct 18, 2011·3 cites·12 claims
- 1963US7808088B2Semiconductor device with improved high current performanceTEXAS INSTRUMENTS INC·Filed 2007·Granted Oct 5, 2010·2 cites·6 claims
- 2062US7361977B2Semiconductor assembly and packaging for high current and low inductanceTEXAS INSTRUMENTS INC·Filed 2005·Granted Apr 22, 2008·2 cites·10 claims
- 2161US7256482B2Integrated circuit chip packaging assemblyTEXAS INSTRUMENTS INC·Filed 2004·Granted Aug 14, 2007·8 cites·8 claims
- 2259US7074653B2Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2004·Granted Jul 11, 2006·6 cites·5 claims
- 2356USRE48420EMethod for fabricating low resistance, low inductance interconnections in high current semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2013·Granted Feb 2, 2021·0 cites·34 claims
- 2456USRE46618EMethod for fabricating low resistance, low inductance interconnections in high current semiconductor devicesTEXAS INSTRUMENTS INC·Filed 2013·Granted Nov 28, 2017·0 cites·30 claims
- 2551US7488623B2Integrated circuit chip packaging assemblyTEXAS INSTRUMENTS INC·Filed 2007·Granted Feb 10, 2009·0 cites·4 claims
- 2651US2008020517A1Multi Lead Frame Power PackageTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 2750US7531895B2Integrated circuit package and method of manufacture thereofTEXAS INSTRUMENTS INC·Filed 2006·Granted May 12, 2009·0 cites·14 claims
- 2848US2013232858A1Use of substituted ureas or urethanes for further improvement of the cold flow properties of mineral oils and crude oilsBASF SE·Filed 2013·Application pending·0 cites
- 2947US2006131734A1Multi lead frame power packageTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 3047US2006211175A1Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packagesLANGE BERNHARD P·Filed 2006·Application pending·0 cites
- 3146US2006038202A1Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packagesLANGE BERNHARD P·Filed 2005·Application pending·0 cites
- 3245US2006192273A1Integrated circuit package and method of manufacture thereofTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 3345US2007287363A1Apparatus for Grinding a WaferTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 3444US8154117B2High power integrated circuit device having bump padsWIKTOR STEFAN W·Filed 2008·Granted Apr 10, 2012·0 cites·19 claims
- 3544US2007290303A1Dual leadframe semiconductor device packageTEXAS INSTRUMENTS DEUTSCHLAND·Filed 2007·Application pending·0 cites
- 3643US2007273010A1Design and Method for Attaching a Die to a Leadframe in a Semiconductor DeviceTEXAS INSTRUMENTS INC·Filed 2007·Application pending·0 cites
- 3742US2008001264A1Exposed top side copper leadframe manufacturingTEXAS INSTRUMENTS INC·Filed 2006·Application pending·0 cites
- 3841US2006273432A1Lead frame with attached componentsTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 3941US2008073757A1Semiconductor dies and methods and apparatus to mold lock a semiconductor dieKUMMERL STEVEN ALFRED·Filed 2006·Application pending·0 cites
- 4040US4646704APressure wave supercharger with vibration damped rotorGEN MOTORS CORP·Filed 1986·Granted Mar 3, 1987·8 cites·7 claims
- 4140US2012211895A1Chip module and method for providing a chip moduleLANGE BERNHARD·Filed 2012·Application pending·0 cites
- 4239US2006037995A1Heatslug to leadframe attachmentTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 4339US2006071351A1Mold compound interlocking feature to improve semiconductor package strengthTEXAS INSTRUMENTS INC·Filed 2004·Application pending·0 cites
- 4439US2006166381A1Mold cavity identification markings for IC packagesLANGE BERNHARD P·Filed 2005·Application pending·0 cites
- 4538US2011189383A1Device and Method for Inert Gas Cure for Leadframe or Substrate StripsTEXAS INSTRUMENTS DEUTSCHLAND·Filed 2011·Application pending·0 cites
- 4638US2006258051A1Method and system for solder die attachTEXAS INSTRUMENTS INC·Filed 2005·Application pending·0 cites
- 4738US2006197199A1Leadframe, coining tool, and methodLANGE BERNHARD P·Filed 2005·Application pending·0 cites
- 4832US2012193801A1Rfid transponder and method for connecting a semiconductor die to an antennaGROSS JOHANN·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →