Integrated circuit package and method of manufacture thereof

Abstract

An integrated circuit (IC) package 100 comprises an IC 102 and leads 104 coupled to the IC. Each lead has a first end 106 configured to be coupled to the integrated circuit and a second end 108 configured to pass through one of a plurality of mounting holes 110 extending through a mounting board 112 . The leads comprise at least one positioning lead 114 comprising a stop 118 being a continuous part of the positioning lead and having a lateral dimension 120 greater than a diameter 122 of a first hole 124 of the plurality of mounting holes. The leads further comprise at least one non-positioning lead 116 having a continuous uniformly shaped body 130 with a lateral dimension 132 less than a diameter 134 of a second hole 136 of the plurality of mounting holes. The stop limits an extension of the non-positioning lead through the second hole.

1 . An integrated circuit package, comprising: 
 an integrated circuit; and    leads coupled to said integrated circuit, each of said leads having a first end configured to be coupled to said integrated circuit and a second end configured to pass through one of a plurality of mounting holes extending through a mounting board, and wherein said leads comprise: 
 one or more positioning lead comprising a stop being a continuous part of said positioning lead and having a lateral dimension greater than a diameter of a first hole of said plurality of mounting holes, and  
 one or more non-positioning lead having a continuous uniformly shaped body with a lateral dimension less than a diameter of a second hole of said plurality of mounting holes, wherein said stop limits an extension of said non-positioning lead through said second hole.  
   
     
     
         2 . The integrated circuit package as recited in  claim 1 , further comprises a mold encompassing said integrated circuit and holding a heat sink above a top surface of said integrated circuit.  
     
     
         3 . The integrated circuit package as recited in  claim 1 , further comprises a mold encompassing said integrated circuit, wherein said first end is encompassed by said mold and at least a portion of said stop is below a bottom surface of said mold.  
     
     
         4 . The integrated circuit package as recited in  claim 3 , wherein said stop is configured to hold said bottom surface above said mounting board by a fixed distance.  
     
     
         5 . The integrated circuit package as recited in  claim 1 , wherein said stop is configured to prevent a segment of said positioning lead from passing through said first hole, said segment being between said first end and said stop.  
     
     
         6 . The integrated circuit package as recited in  claim 1 , wherein said stop comprises a bend in said positioning lead.  
     
     
         7 . The integrated circuit package as recited in  claim 6 , wherein said bend has an interior angle ranging from about 70 to about 110 degrees.  
     
     
         8 . The integrated circuit package as recited in  claim 1 , wherein said stop comprises an increased width in said positioning lead.  
     
     
         9 . The integrated circuit package as recited in  claim 8 , wherein said increased width is at least about 5 percent greater than said diameter of said first hole.  
     
     
         10 . The integrated circuit package as recited in  claim 1 , further comprises at least two of said positioning leads, wherein said positioning leads are corner leads being coupled to opposing corners of said integrated circuit.  
     
     
         11 . The integrated circuit package as recited in  claim 1 , further comprises at least four of said positioning leads, wherein said positioning leads are corner leads each one of said positioning leads being coupled to different corners of said integrated circuit.  
     
     
         12 . The integrated circuit package as recited in  claim 1 , wherein said stop is located on a side of said positioning lead that is non-proximal to an adjacent non-positioning lead.  
     
     
         13 . The integrated circuit package as recited in  claim 1 , wherein said non-positioning lead comprises short non-positioning leads interleaved with long non-positioning leads, both said short and long non-positioning leads being coupled to a same side of said integrated circuit.  
     
     
         14 . A method of manufacturing an integrated circuit package, comprising: 
 forming a plurality of leads, each of said leads having a first end configured to be coupled to an integrated circuit and a second end configured to pass through one of a plurality of holes extending through a mounting board, including: 
 forming a positioning lead comprising a stop being a continuous part of said positioning lead and having a lateral dimension greater than a diameter of a first hole of said plurality of mounting holes; and  
 forming a non-positioning lead having a continuous uniformly shaped body having a lateral dimension less than a diameter of a second hole of said plurality of mounting holes, wherein said stop limits an extension of said non-positioning lead through said second hole.  
   
     
     
         15 . The method recited in  claim 14 , wherein forming said positioning lead comprises: 
 forming a layout pattern on a metal sheet, wherein said layout pattern comprises a lead layout pattern for said least one positioning lead having said stop; and    removing portions of said metal sheet that are outside of said layout pattern to thereby form a lead frame comprising said at least one positioning lead.    
     
     
         16 . The method as recited in  claim 15 , wherein said stop comprises a width greater than that of an adjacent portion of said positioning lead, said adjacent portion being configured to pass through said first hole.  
     
     
         17 . The method of fabrication recited in  claim 14 , wherein forming said positioning lead comprises: 
 forming a lead layout pattern on a metal sheet, wherein said layout pattern comprises a lead layout pattern for a plurality of uniformly shaped leads;    removing portions of said metal sheet that are outside of said layout pattern to thereby form said leads that are uniformly-shaped leads; and    bending at least one of said uniformly shaped leads to form said positioning lead comprising said stop.    
     
     
         18 . The method as recited in  claim 17 , wherein said stop comprises a bend with an interior angle ranging from about 70 to about 110 degrees.  
     
     
         19 . The method as recited in  claim 14 , further includes bending said positioning lead to configure said stop to be below a bottom surface of a mold encompassing said integrated circuit.  
     
     
         20 . The method as recited in  claim 14 , further comprising 
 coupling a heat sink to a top surface of said integrated circuit; and    encompassing said integrated circuit in a mold.