Inventor · disambiguated record
Hee Bong Lee
Also filed as: LEE HEE B · LEE HEE BONG
10 granted patents·2 pending applications·97 citations·filing 2004–2011
88Inventor score
Top patents by PatentIndex Score
12 records- 0189US7238258B2System for peeling semiconductor chips from tapeSTATS CHIPPAC LTD·Filed 2005·Granted Jul 3, 2007·21 cites·16 claims
- 0287US8548514B2Method for resource element group downsizing of R-PDCCH and mobile telecommunication system for the sameKIM SANG HA·Filed 2011·Granted Oct 1, 2013·13 cites·10 claims
- 0383US8848596B2Method for controlling timing of backhaul link and relay system for the sameSHIN HONG SUP·Filed 2011·Granted Sep 30, 2014·9 cites·16 claims
- 0483US7709946B2Micro universal serial bus (USB) memory packageHANA MICRON CO LTD·Filed 2006·Granted May 4, 2010·31 cites·12 claims
- 0575US7958628B2Bonding tool for mounting semiconductor chipsSTATS CHIPPAC LTD·Filed 2009·Granted Jun 14, 2011·4 cites·25 claims
- 0674US7650688B2Bonding tool for mounting semiconductor chipsCHIPPAC INC·Filed 2004·Granted Jan 26, 2010·15 cites·22 claims
- 0754US8410597B2Three dimensional semiconductor deviceSHIM HYUN GUE·Filed 2009·Granted Apr 2, 2013·3 cites·14 claims
- 0844US7306971B2Semiconductor chip packaging method with individually placed film adhesive piecesCHIPPAC INC·Filed 2004·Granted Dec 11, 2007·1 cites·4 claims
- 0940US2007085184A1Stacked die packaging systemSTATS CHIPPAC LTD·Filed 2005·Application pending·0 cites
- 1037US8470836B2Dipeptidyl peptidase-IV inhibiting compounds, methods of preparing the same, and pharmaceutical compositions containing the same as active agentLEE CHANG-SEOK·Filed 2008·Granted Jun 25, 2013·0 cites·12 claims
- 1136US8741927B2Production method of intermediate compound for synthesizing medicamentKIM BONG CHAN·Filed 2011·Granted Jun 3, 2014·0 cites·22 claims
- 1234US2012106432A1Method for transmitting uplink signal with periodic and relay system for the sameLEE HEE BONG·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →