Inventor · disambiguated record
Chih-Kang Yang
Also filed as: YANG CHIH-KANG
5 granted patents·7 pending applications·6 citations·filing 2007–2012
67Inventor score
Files withFOXCONN ADVANCED TECH INC6HUANG PAI-HUNG2CHAO KUAN-LI1FOXCONN ADVANCED TECHNOLOGY INC1KUO PING YANG1
Top patents by PatentIndex Score
12 records- 0172US7698811B2Method for manufacturing multilayer printed circuit boards using inner substrateFOXCONN ADVANCED TECH INC·Filed 2007·Granted Apr 20, 2010·4 cites·18 claims
- 0268US8401858B2Method and system for voice communicationYANG CHIH-KANG·Filed 2010·Granted Mar 19, 2013·2 cites·12 claims
- 0349US2010139966A1Inner substrate for manufacturing multilayer printed circuit boardsFOXCONN ADVANCED TECH INC·Filed 2010·Application pending·0 cites
- 0447US2009314739A1Wet processing system and wet processing methodFOXCONN ADVANCED TECH INC·Filed 2008·Application pending·0 cites
- 0546US7897199B2Method for plating flexible printed circuit boardFOXCONN ADVANCED TECHNOLOGY INC·Filed 2008·Granted Mar 1, 2011·0 cites·12 claims
- 0646US2011274866A1Inner substrate for manufacturing multilayer printed circuit boardsFOXCONN ADVANCED TECH INC·Filed 2011·Application pending·0 cites
- 0742US8268537B2Method for manufacturing printed circuit boardHUANG PAI-HUNG·Filed 2008·Granted Sep 18, 2012·0 cites·11 claims
- 0842US2009025582A1Screen printing method for printing a printed circuit boardFOXCONN ADVANCED TECH INC·Filed 2007·Application pending·0 cites
- 0939US2011125502A1Method of putting identification codes in a documentKUO PING YANG·Filed 2010·Application pending·0 cites
- 1039US2009056624A1Fluid circulating system for manufacturing printed circuit boardFOXCONN ADVANCED TECH INC·Filed 2008·Application pending·0 cites
- 1135US2012211267A1Printed circuit board substrateHUANG PAI-HUNG·Filed 2012·Application pending·0 cites
- 1231US8294951B2Method of reducing the amount of black in an imageCHAO KUAN-LI·Filed 2010·Granted Oct 23, 2012·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →