Printed circuit board substrate

Abstract

A printed circuit board substrate includes a metal-clad substrate and a number of N spaced circuit substrates arranged on the metal-clad substrate along an imaginary circle, and N is a natural number greater than 2. The circuit substrates are equiangularly arranged about the center of the circle, and each of the circuit substrates is oriented 360/N degrees with respect to a neighboring printed circuit board.

1 . A printed circuit board substrate, comprising:
 a first metal-clad substrate;   a number of N spaced circuit substrates arranged on the first metal-clad substrate along an imaginary circle, the circuit substrates being equiangularly arranged about the center of the circle, each of the circuit substrates being oriented 360/N degrees with respect to a neighboring circuit substrate, N representing a natural number greater than 2.   
     
     
         2 . The printed circuit board substrate as claimed in  claim 1 , wherein the first metal-clad substrate includes a first insulation layer and a first electrically conductive layer formed thereon, the first electrically conductive layer is configured to form electrically conductive patterns. 
     
     
         3 . The printed circuit board substrate as claimed in  claim 2 , wherein each of the circuit substrates has a second insulation layer and a plurality of electrical traces formed thereon, the electrical traces are in contact with the first insulation layer. 
     
     
         4 . The printed circuit board substrate as claimed in  claim 1 , further comprising a second metal-clad substrate, the circuit substrates are sandwiched between the first and second metal-clad substrates. 
     
     
         5 . The printed circuit board substrate as claimed in  claim 1 , wherein N is equal to 4, and each of the circuit substrates is oriented 90 degrees with respect to a neighboring circuit substrate. 
     
     
         6 . A circuit substrate, comprising:
 a first metal-clad substrate;   a number of N spaced second circuit substrates arranged centrosymmetric with respect to a given point on the metal-clad substrate, each of the circuit substrates being oriented 360/N degrees with respect to a neighboring circuit substrate, N representing a natural number greater than 2.   
     
     
         7 . The printed circuit board substrate as claimed in  claim 6 , wherein the first metal-clad substrate includes a first insulation layer and a first electrically conductive layer formed thereon, the first electrically conductive layer is configured to form electrically conductive patterns. 
     
     
         8 . The printed circuit board substrate as claimed in  claim 7 , wherein each of the circuit substrates has a second insulation layer and a plurality of electrical traces formed thereon, the electrical traces are in contact with the first insulation layer. 
     
     
         9 . The printed circuit board substrate as claimed in  claim 6 , further comprising a second metal-clad substrate, the circuit substrates are sandwiched between the first and second metal-clad substrates. 
     
     
         10 . The printed circuit board substrate as claimed in  claim 6 , wherein N is equal to 4, and each of the circuit substrates is oriented 90 degrees with respect to a neighboring circuit substrate.