Inventor · disambiguated record
Sin-Woo Kang
Also filed as: KANG SIN W · KANG SIN YOUNG · KANG SIN-WOO
9 granted patents·3 pending applications·75 citations·filing 1990–2015
87Inventor score
Top patents by PatentIndex Score
12 records- 0193US8592988B2Semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·19 cites·11 claims
- 0283US9559002B2Methods of fabricating semiconductor devices with blocking layer patternsSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 31, 2017·4 cites·17 claims
- 0383US8841754B2Semiconductor devices with stress relief layersSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 23, 2014·8 cites·16 claims
- 0481US8890282B2Integrated circuit devices including through-silicon via (TSV) contact pads electronically insulated from a substrateSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 18, 2014·6 cites·20 claims
- 0572US5146451ACompact disk player with two stacked, rotary, rotationally offset carrying plates for plural disksSAMSUNG ELECTRONICS CO LTD·Filed 1990·Granted Sep 8, 1992·24 cites·5 claims
- 0671US9147640B2Semiconductor devices having back side bonding structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 29, 2015·3 cites·17 claims
- 0771US8836109B2Semiconductor device and method of manufacturing a semiconductor deviceYUN KI-YOUNG·Filed 2012·Granted Sep 16, 2014·9 cites·15 claims
- 0861US9418915B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 16, 2016·1 cites·13 claims
- 0955US8729684B2Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the samePARK YEONG-LYEOL·Filed 2011·Granted May 20, 2014·1 cites·10 claims
- 1050US2014225113A1Interposer chip, multi-chip package including the interposer chip, and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Application pending·0 cites
- 1142US2004060841A1Booklet blister package and its manufacturing methodFiled 2002·Application pending·0 cites
- 1240US2015137388A1Semiconductor devicesKIM EUN-JI·Filed 2014·Application pending·0 cites
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