Inventor · disambiguated record
Nancy Fung
Also filed as: FUNG NANCY
20 granted patents·15 pending applications·183 citations·filing 2004–2025
92Inventor score
Files withAPPLIED MATERIALS INC31FUNG NANCY1MICROSOFT TECHNOLOGY LICENSING LLC1RUI YING1YOUSIF IMAD1
Top patents by PatentIndex Score
35 records- 0197US8748322B1Silicon oxide recess etchAPPLIED MATERIALS INC·Filed 2013·Granted Jun 10, 2014·125 cites·19 claims
- 0293US11527414B2Methods for etching structures with oxygen pulsingAPPLIED MATERIALS INC·Filed 2021·Granted Dec 13, 2022·3 cites·16 claims
- 0390US11776811B2Selective deposition of carbon on photoresist layer for lithography applicationsAPPLIED MATERIALS INC·Filed 2021·Granted Oct 3, 2023·2 cites·20 claims
- 0489US7879183B2Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2008·Granted Feb 1, 2011·13 cites·25 claims
- 0586US10954129B2Diamond-like carbon as mandrelAPPLIED MATERIALS INC·Filed 2018·Granted Mar 23, 2021·3 cites·10 claims
- 0686US8329593B2Method and apparatus for removing polymer from the wafer backside and edgeYOUSIF IMAD·Filed 2007·Granted Dec 11, 2012·14 cites·17 claims
- 0776US12249509B2Selective deposition of carbon on photoresist layer for lithography applicationsAPPLIED MATERIALS INC·Filed 2023·Granted Mar 11, 2025·0 cites·20 claims
- 0875US10910381B2Multicolor approach to DRAM STI active cut patterningAPPLIED MATERIALS INC·Filed 2019·Granted Feb 2, 2021·1 cites·19 claims
- 0975US7628863B2Heated gas box for PECVD applicationsAPPLIED MATERIALS INC·Filed 2004·Granted Dec 8, 2009·20 cites·10 claims
- 1074US11638374B2Multicolor approach to DRAM STI active cut patterningAPPLIED MATERIALS INC·Filed 2022·Granted Apr 25, 2023·0 cites·10 claims
- 1172US12374557B2Methods for etching structures with oxygen pulsingAPPLIED MATERIALS INC·Filed 2022·Granted Jul 29, 2025·0 cites·16 claims
- 1270US11335690B2Multicolor approach to DRAM STI active cut patterningAPPLIED MATERIALS INC·Filed 2021·Granted May 17, 2022·0 cites·10 claims
- 1369US2025226221A1Selective deposition of carbon on photoresist layer for lithography applicationsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1467US2022367186A1Patterning scheme to improve euv resist and hard mask selectivityAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1566US10283370B1Silicon addition for silicon nitride etching selectivityAPPLIED MATERIALS INC·Filed 2018·Granted May 7, 2019·1 cites·14 claims
- 1665US2025180987A1Dry development for metal-oxide photo resistsAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1763US2024319603A1Euv sensitive metal oxide material as underlayer for thin car to improve pattern transferAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1861US12486559B2Method of metal oxide infiltration into photoresistAPPLIED MATERIALS INC·Filed 2022·Granted Dec 2, 2025·0 cites·19 claims
- 1960US12283484B2Selective deposition of carbon on photoresist layer for lithography applicationsAPPLIED MATERIALS INC·Filed 2021·Granted Apr 22, 2025·0 cites·25 claims
- 2060US11437238B2Patterning scheme to improve EUV resist and hard mask selectivityAPPLIED MATERIALS INC·Filed 2019·Granted Sep 6, 2022·0 cites·18 claims
- 2159US2025329531A1Selective chemical method for contact hole shrinkingAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2258US2025385093A1Underlayer with fluorine for extreme ultraviolet (euv) lithographyAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2358US2025385101A1Extreme ultraviolet (euv) activated underlayerAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2455US11658042B2Methods for etching structures and smoothing sidewallsAPPLIED MATERIALS INC·Filed 2021·Granted May 23, 2023·0 cites·19 claims
- 2554US2025258433A1Underlayer treatment for improved photoresist adhesionAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2650US10789080B2Multi-tier customizable portal deployment systemMICROSOFT TECHNOLOGY LICENSING LLC·Filed 2015·Granted Sep 29, 2020·1 cites·19 claims
- 2747US2009302002A1Method and apparatus for removing polymer from a substrateAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 2846US11658043B2Selective anisotropic metal etchAPPLIED MATERIALS INC·Filed 2021·Granted May 23, 2023·0 cites·20 claims
- 2946US2011120505A1Apparatus and method for front side protection during backside cleaningAPPLIED MATERIALS INC·Filed 2011·Application pending·0 cites
- 3045US10867795B2Method of etching hardmasks containing high hardness materialsAPPLIED MATERIALS INC·Filed 2018·Granted Dec 15, 2020·0 cites·5 claims
- 3145US2009293907A1Method of substrate polymer removalFUNG NANCY·Filed 2008·Application pending·0 cites
- 3244US2014357083A1Directed block copolymer self-assembly patterns for advanced photolithography applicationsAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 3340US2009191711A1Hardmask open process with enhanced cd space shrink and reductionRUI YING·Filed 2008·Application pending·0 cites
- 3437US2011079918A1Plasma-based organic mask removal with silicon fluorideAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 3536US2011162674A1In-situ process chamber clean to remove titanium nitride etch by-productsAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →