Inventor · disambiguated record
Seok-Kyu Lee
Also filed as: LEE SEOK K · LEE SEOK KYU
12 granted patents·23 pending applications·177 citations·filing 2001–2022
91Inventor score
Top patents by PatentIndex Score
35 records- 0193US6910266B2Printed circuit board with embedded capacitors therein, and process for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Jun 28, 2005·69 cites·14 claims
- 0289US7092237B2Printed circuit board with embedded capacitors therein, and process for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2005·Granted Aug 15, 2006·18 cites·6 claims
- 0383US7351915B2Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2004·Granted Apr 1, 2008·31 cites·8 claims
- 0481US7326858B2Printed circuit board with embedded capacitors and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2003·Granted Feb 5, 2008·29 cites·5 claims
- 0580US8209860B2Method of manufacturing printed circuit board having metal bumpAN JIN YONG·Filed 2009·Granted Jul 3, 2012·9 cites·8 claims
- 0676US8445790B2Coreless substrate having filled via pad and method of manufacturing the sameLEE SEOK KYU·Filed 2009·Granted May 21, 2013·8 cites·4 claims
- 0772US8563141B2Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the sameLEE JAE JOON·Filed 2010·Granted Oct 22, 2013·1 cites·3 claims
- 0871US8435376B2Carrier for manufacturing substrate and method of manufacturing substrate using the sameKIM JIN HO·Filed 2010·Granted May 7, 2013·2 cites·5 claims
- 0970US7971352B2Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2008·Granted Jul 5, 2011·5 cites·11 claims
- 1065US8883016B2Carrier for manufacturing printed circuit board, method of manufacturing the same and method of manufacturing printed circuit board using the sameSAMSUNG ELECTRO MECH·Filed 2013·Granted Nov 11, 2014·0 cites·10 claims
- 1156US2013243995A1Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The SameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1255US2009325105A1Printed circuit board with embedded capacitors therein, and process for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1355US2013243941A1Method of manufacturing coreless substrate having filled via padSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 1453US2015049445A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 1552US7570491B2Printed circuit board with embedded capacitors therein, and process for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2003·Granted Aug 4, 2009·4 cites·8 claims
- 1651US2011079349A1Method of manufacturing printed circuit boardSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1751US2010096171A1Printed circuit board having round solder bump and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1851US2010148348A1Package substrateSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 1950US2007146980A1Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2007·Application pending·0 cites
- 2050US2008125456A1Injection of TacrolimusCHONG KUN DANG PHARM CORP·Filed 2005·Application pending·0 cites
- 2150US2009283302A1Printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 2249US2015062850A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 2348US2011076472A1Package substrateKIM JIN HO·Filed 2009·Application pending·0 cites
- 2448US2011067901A1Package substrateKIM JIN HO·Filed 2009·Application pending·0 cites
- 2547US2024400043A1Method for sharing information on autonomous moving vehicle and controlling autonomous moving vehicle, and system thereforTELECONS CO LTD·Filed 2022·Application pending·0 cites
- 2647US2016212856A1Method for manufacturing electronic component embedding substrate and electronic component embedding substrateSAMSUNG ELECTRO MECH·Filed 2016·Application pending·0 cites
- 2746US2009191274A1Pharmaceutical composition of amlodipine maleate having enhanced stabilityLEE SANG-JOON·Filed 2005·Application pending·0 cites
- 2845US2003129219A1Self-emulsifying matrix type trandermal preparationFiled 2001·Application pending·0 cites
- 2945US2009038837A1Multilayered printed circuit board and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3043US7284317B2Method of producing printed circuit board with embedded resistorSAMSUNG ELECTRO MECH·Filed 2004·Granted Oct 23, 2007·1 cites·16 claims
- 3143US2006115770A1Printed circuit board including embedded capacitor and method of fabricating sameSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 3243US2014347834A1Electronic component embedded printed circuit board and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 3342US2014186581A1Primer-coated copper foil having superior adhesive strength and method for producing the sameSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 3437US2003150101A1Printed circuit board with buried resistor and manufacturing method thereofSAMSUNG ELECTRO MECH·Filed 2002·Application pending·0 cites
- 3536US2006014327A1Method of fabricating PCB including embedded passive chipSAMSUNG ELECTRO MECH·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →