Carrier For Manufacturing Substrate and Method Of Manufacturing Substrate Using The Same

Abstract

Disclosed herein is a carrier for manufacturing a substrate, including: a base plate; adhesive layers formed on one side or both sides of the base plate; auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers. The carrier is advantageous in that a metal layer and an auxiliary adhesive layer are attached to each other by the adhesivity of the auxiliary adhesive layer, so that it is not required to use vacuum adsorption, with the result that a process of manufacturing a substrate can be performed more stably.

What is claimed is: 
     
         1 . A carrier for manufacturing a substrate, comprising:
 a base plate;   adhesive layers formed on one side or both sides of the base plate;   auxiliary adhesive layers, each of which is buried in one side of each of the adhesive layers, has a smaller area than each of the adhesive layers and has lower adhesivity than each of the adhesive layers; and   metal layers, each of which is formed on one side of each of the auxiliary adhesive layers, whose edges are attached to the adhesive layers, and whose other portions excluding the edges are attached to the auxiliary adhesive layers.   
     
     
         2 . The carrier for manufacturing a substrate according to  claim 1 , wherein the adhesive layer is prepreg, an ajinomoto build up film (ABF) or an epoxy film. 
     
     
         3 . The carrier for manufacturing a substrate according to  claim 1 , wherein the auxiliary adhesive layer is a polymer film. 
     
     
         4 . The carrier for manufacturing a substrate according to  claim 1 , wherein the auxiliary adhesive layer has an adhesivity of 0.01˜0.2 KN/m. 
     
     
         5 . The carrier for manufacturing a substrate according to  claim 1 , wherein the adhesivity of one side of the auxiliary adhesive layer is lower than that of the other side of the auxiliary adhesive layer.