Inventor · disambiguated record
Bingxi Sun
Also filed as: SUN BING XI · SUN BINGXI
10 granted patents·2 pending applications·624 citations·filing 1997–2004
93Inventor score
Files withAPPLIED MATERIALS INC12
Top patents by PatentIndex Score
12 records- 0196US6066892ACopper alloy seed layer for copper metallization in an integrated circuitAPPLIED MATERIALS INC·Filed 1998·Granted May 23, 2000·185 cites·20 claims
- 0294US6160315ACopper alloy via structureAPPLIED MATERIALS INC·Filed 2000·Granted Dec 12, 2000·73 cites·24 claims
- 0393US6037257ASputter deposition and annealing of copper alloy metallizationAPPLIED MATERIALS INC·Filed 1997·Granted Mar 14, 2000·117 cites·15 claims
- 0489US6566259B1Integrated deposition process for copper metallizationAPPLIED MATERIALS INC·Filed 2000·Granted May 20, 2003·41 cites·27 claims
- 0583US6387805B2Copper alloy seed layer for copper metallizationAPPLIED MATERIALS INC·Filed 1997·Granted May 14, 2002·58 cites·38 claims
- 0681US6174811B1Integrated deposition process for copper metallizationAPPLIED MATERIALS INC·Filed 1998·Granted Jan 16, 2001·48 cites·7 claims
- 0772US6488823B1Stress tunable tantalum and tantalum nitride filmsAPPLIED MATERIALS INC·Filed 1998·Granted Dec 3, 2002·30 cites·12 claims
- 0869US6217715B1Coating of vacuum chambers to reduce pump down time and base pressureAPPLIED MATERIALS INC·Filed 1997·Granted Apr 17, 2001·31 cites·13 claims
- 0968US6313033B1Ionized metal plasma Ta, TaNx, W, and WNx liners for gate electrode applicationsAPPLIED MATERIALS INC·Filed 1999·Granted Nov 6, 2001·33 cites·11 claims
- 1063US6881673B2Integrated deposition process for copper metallizationAPPLIED MATERIALS INC·Filed 2003·Granted Apr 19, 2005·8 cites·19 claims
- 1139US2004168705A1Method of cleaning a surface of a material layerAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 1238US2004018715A1Method of cleaning a surface of a material layerAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →