Inventor · disambiguated record
Khaled A. Elsheref
Also filed as: ELSHEREF KHALED · ELSHEREF KHALED A
9 granted patents·2 pending applications·61 citations·filing 2003–2012
87Inventor score
Top patents by PatentIndex Score
11 records- 0192US7425716B2Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to a large area electron beamAPPLIED MATERIALS INC·Filed 2006·Granted Sep 16, 2008·14 cites·27 claims
- 0284US8481422B2Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layerCHAN KELVIN·Filed 2012·Granted Jul 9, 2013·6 cites·16 claims
- 0382US7547643B2Techniques promoting adhesion of porous low K film to underlying barrier layerAPPLIED MATERIALS INC·Filed 2005·Granted Jun 16, 2009·6 cites·17 claims
- 0480US7777197B2Vacuum reaction chamber with x-lamp heaterAPPLIED MATERIALS INC·Filed 2006·Granted Aug 17, 2010·7 cites·20 claims
- 0574US8236684B2Prevention and reduction of solvent and solution penetration into porous dielectrics using a thin barrier layerCHAN KELVIN·Filed 2008·Granted Aug 7, 2012·4 cites·10 claims
- 0670US7790583B2Clean process for an electron beam sourceAPPLIED MATERIALS INC·Filed 2007·Granted Sep 7, 2010·1 cites·12 claims
- 0764US7323399B2Clean process for an electron beam sourceAPPLIED MATERIALS INC·Filed 2004·Granted Jan 29, 2008·10 cites·21 claims
- 0864US6878644B2Multistep cure technique for spin-on-glass filmsAPPLIED MATERIALS INC·Filed 2003·Granted Apr 12, 2005·9 cites·16 claims
- 0961US7045798B2Characterizing an electron beam treatment apparatusAPPLIED MATERIALS INC·Filed 2004·Granted May 16, 2006·4 cites·21 claims
- 1045US2005224722A1Method and apparatus for reducing charge density on a dielectric coated substrate after exposure to large area electron beamAPPLIED MATERIALS INC·Filed 2004·Application pending·0 cites
- 1145US2006289795A1Vacuum reaction chamber with x-lamp heaterDUBOIS DALE R·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →