Inventor · disambiguated record
Hiromasa Takeda
Also filed as: TAKEDA HIROMASA
19 granted patents·3 pending applications·147 citations·filing 1986–2017
93Inventor score
Files withTAKEDA HIROMASA5TOYODA CHUO KENKYUSHO KK5ELPIDA MEMORY INC4MICRON TECHNOLOGY INC3ARAI TOHRU1
Top patents by PatentIndex Score
22 records- 0192US8426983B2Semiconductor deviceTAKEDA HIROMASA·Filed 2011·Granted Apr 23, 2013·19 cites·22 claims
- 0279US4844949AMethod of surface treatment and apparatus used thereforTOYODA CHUO KENKYUSHO KK·Filed 1988·Granted Jul 4, 1989·39 cites·15 claims
- 0371US8922053B2Semiconductor chip and semiconductor device including the sameTAKEDA HIROMASA·Filed 2011·Granted Dec 30, 2014·3 cites·15 claims
- 0471US5443662AMethod of forming a nitride or carbonitride layerTOYODA CHUO KENKYUSHO KK·Filed 1993·Granted Aug 22, 1995·31 cites·8 claims
- 0567US8569898B2Semiconductor deviceTAKEDA HIROMASA·Filed 2010·Granted Oct 29, 2013·2 cites·16 claims
- 0665US8853822B2Semiconductor deviceELPIDA MEMORY INC·Filed 2012·Granted Oct 7, 2014·2 cites·10 claims
- 0762US9881665B2Semiconductor memory device including output bufferMICRON TECHNOLOGY INC·Filed 2017·Granted Jan 30, 2018·1 cites·20 claims
- 0858US8238133B2Semiconductor device with a selection circuit selecting a specific padTAJIMA SHINGO·Filed 2010·Granted Aug 7, 2012·1 cites·17 claims
- 0956US4786526ASurface treating method and apparatusTOYODA CHUO KENKYUSHO KK·Filed 1986·Granted Nov 22, 1988·17 cites·10 claims
- 1054US5620521AMethod for surface treatmentTOYODA CHUO KENKYUSHO KK·Filed 1995·Granted Apr 15, 1997·17 cites·18 claims
- 1152US8796077B2Semiconductor deviceELPIDA MEMORY INC·Filed 2013·Granted Aug 5, 2014·0 cites·16 claims
- 1249US11834737B2Titanium alloy coating film and titanium alloy target materialDAIDO STEEL CO LTD·Filed 2017·Granted Dec 5, 2023·0 cites·6 claims
- 1348US9892780B1Semiconductor memory device including output bufferMICRON TECHNOLOGY INC·Filed 2017·Granted Feb 13, 2018·0 cites·20 claims
- 1445US9627013B2Semiconductor memory device including output bufferMICRON TECHNOLOGY INC·Filed 2015·Granted Apr 18, 2017·0 cites·5 claims
- 1544US2015022255A1Semiconductor devicePS4 LUXCO S A R I·Filed 2014·Application pending·0 cites
- 1643US4871401AFluidized bed method of forming a nitride or carbonitride layerTOYODA CHUO KENKYUSHO KK·Filed 1987·Granted Oct 3, 1989·9 cites·19 claims
- 1740US8587097B2Semiconductor device that suppresses malfunctions due to noise generated in internal circuitTAKEDA HIROMASA·Filed 2010·Granted Nov 19, 2013·0 cites·19 claims
- 1838US2011084395A1Semiconductor package substrate and semiconductor device having the sameELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 1935US8331182B2Semiconductor device including plural electrode padsTAKEDA HIROMASA·Filed 2010·Granted Dec 11, 2012·0 cites·20 claims
- 2033US9159663B2Semiconductor device with respective electrode pad rows and respective external electrodes electrically connected and arranged in the respective end portions of the substrateISA SATOSHI·Filed 2011·Granted Oct 13, 2015·0 cites·20 claims
- 2133US2010188878A1Semiconductor device that supresses malfunctions due to voltage reductionELPIDA MEMORY INC·Filed 2010·Application pending·0 cites
- 2230US4892759AMethod for surface treatmentARAI TOHRU·Filed 1988·Granted Jan 9, 1990·6 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →