Inventor · disambiguated record
Wing Him Lau
Also filed as: LAU WING HIM
16 granted patents·1,470 citations·filing 2001–2012
96Inventor score
Top patents by PatentIndex Score
16 records- 0198US6995460B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Feb 7, 2006·119 cites·19 claims
- 0298US6946324B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2003·Granted Sep 20, 2005·182 cites·10 claims
- 0398US6635957B2Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2001·Granted Oct 21, 2003·199 cites·13 claims
- 0496US7247526B1Process for fabricating an integrated circuit packageASAT LTD·Filed 2005·Granted Jul 24, 2007·134 cites·14 claims
- 0596US7226811B1Process for fabricating a leadless plastic chip carrierASAT LTD·Filed 2005·Granted Jun 5, 2007·55 cites·3 claims
- 0696US6989294B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2003·Granted Jan 24, 2006·101 cites·8 claims
- 0796US6933594B2Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2001·Granted Aug 23, 2005·140 cites·12 claims
- 0895US7271032B1Leadless plastic chip carrier with etch back pad singulationASAT LTD·Filed 2005·Granted Sep 18, 2007·43 cites·29 claims
- 0995US7049177B1Leadless plastic chip carrier with standoff contacts and die attach padASAT LTD·Filed 2004·Granted May 23, 2006·192 cites·11 claims
- 1092US6734044B1Multiple leadframe laminated IC packageASAT LTD·Filed 2002·Granted May 11, 2004·78 cites·9 claims
- 1189US6667191B1Chip scale integrated circuit packageASAT LTD·Filed 2002·Granted Dec 23, 2003·62 cites·20 claims
- 1288US7449771B1Multiple leadframe laminated IC packageASAT LTD·Filed 2003·Granted Nov 11, 2008·56 cites·5 claims
- 1388US6872661B1Leadless plastic chip carrier with etch back pad singulation and die attach pad arrayASAT LTD·Filed 2002·Granted Mar 29, 2005·53 cites·19 claims
- 1483US7270867B1Leadless plastic chip carrierASAT LTD·Filed 2004·Granted Sep 18, 2007·34 cites·11 claims
- 1574US8330270B1Integrated circuit package having a plurality of spaced apart pad portionsLIN GERALDINE TSUI YEE·Filed 2004·Granted Dec 11, 2012·22 cites·15 claims
- 1647US9520306B2Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portionLIN GERALDINE TSUI YEE·Filed 2012·Granted Dec 13, 2016·0 cites·12 claims
Join the waitlist — get patent alerts
Get an alert when Wing Him Lau files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →