Inventor · disambiguated record
Hiroyuki Toshima
Also filed as: TOSHIMA HIROYUKI
22 granted patents·11 pending applications·38 citations·filing 2004–2022
91Inventor score
Top patents by PatentIndex Score
33 records- 0187US8399353B2Methods of forming copper wiring and copper film, and film forming systemISHIZAKA TADAHIRO·Filed 2011·Granted Mar 19, 2013·9 cites·13 claims
- 0276US8617363B2Magnetron sputtering apparatusTOKYO ELECTRON LTD·Filed 2012·Granted Dec 31, 2013·3 cites·17 claims
- 0376US7594805B2Adhesive injection apparatusHONDA MOTOR CO LTD·Filed 2005·Granted Sep 29, 2009·6 cites·14 claims
- 0473US8859422B2Method of forming copper wiring and method and system for forming copper filmISHIZAKA TADAHIRO·Filed 2012·Granted Oct 14, 2014·3 cites·26 claims
- 0573US8384207B2Semiconductor integrated circuit device having insulated through wiresHONDA MOTOR CO LTD·Filed 2006·Granted Feb 26, 2013·8 cites·19 claims
- 0672US11551930B2Methods to reshape spacer profiles in self-aligned multiple patterningTOKYO ELECTRON LTD·Filed 2019·Granted Jan 10, 2023·1 cites·25 claims
- 0772US10068798B2Method and processing apparatus for performing pre-treatment to form copper wiring in recess formed in substrateTOKYO ELECTRON LTD·Filed 2017·Granted Sep 4, 2018·1 cites·4 claims
- 0871US10189230B2Method for forming copper filmTOKYO ELECTRON LTD·Filed 2017·Granted Jan 29, 2019·1 cites·5 claims
- 0960US11742190B2Sputtering apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2021·Granted Aug 29, 2023·0 cites·12 claims
- 1058US12014911B2Sputtering apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jun 18, 2024·0 cites·7 claims
- 1157US11851750B2Apparatus and method for performing sputtering processTOKYO ELECTRON LTD·Filed 2021·Granted Dec 26, 2023·0 cites·15 claims
- 1256US11705315B2Sputtering apparatus and sputtering methodTOKYO ELECTRON LTD·Filed 2021·Granted Jul 18, 2023·0 cites·10 claims
- 1356US7308395B2Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate groupTOSHIBA KK·Filed 2004·Granted Dec 11, 2007·6 cites·12 claims
- 1454US2023051865A1Pvd apparatusTOKYO ELECTRON LTD·Filed 2022·Application pending·0 cites
- 1553US2013081938A1Magnetron sputtering apparatus and methodMIZUNO SHIGERU·Filed 2012·Application pending·0 cites
- 1652US2014287163A1Method of forming copper wiring and method and system for forming copper filmTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 1750US11410837B2Film-forming deviceTOKYO ELECTRON LTD·Filed 2017·Granted Aug 9, 2022·0 cites·3 claims
- 1849US12027353B2Substrate processing method and apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Jul 2, 2024·0 cites·4 claims
- 1949US2022081757A1Film forming apparatus, film forming system, and film forming methodTOKYO ELECTRON LTD·Filed 2021·Application pending·0 cites
- 2048US11479848B2Film forming apparatus and methodTOKYO ELECTRON LTD·Filed 2021·Granted Oct 25, 2022·0 cites·14 claims
- 2147US9064690B2Method for forming Cu wiringTOKYO ELECTRON LTD·Filed 2013·Granted Jun 23, 2015·0 cites·7 claims
- 2246US11469106B2Hard mask and hard mask forming methodTOKYO ELECTRON LTD·Filed 2017·Granted Oct 11, 2022·0 cites·6 claims
- 2346US2011017706A1Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2444US2020227273A1Hard mask and semiconductor device manufacturing methodTOKYO ELECTRON LTD·Filed 2020·Application pending·0 cites
- 2543US11664207B2Film-forming apparatus, film-forming system, and film-forming methodTOKYO ELECTRON LTD·Filed 2019·Granted May 30, 2023·0 cites·10 claims
- 2643US11512388B2Film forming apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 29, 2022·0 cites·7 claims
- 2743US11158492B2Film forming apparatus and film forming methodTOKYO ELECTRON LTD·Filed 2019·Granted Oct 26, 2021·0 cites·18 claims
- 2842US11495446B2Film formation device and film formation methodTOKYO ELECTRON LTD·Filed 2019·Granted Nov 8, 2022·0 cites·8 claims
- 2941US2008184543A1Method and apparatus for manufacturing semiconductor device, and storage medium for executing the methodTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 3040US2013237053A1Film forming method and film forming apparatusISHIZAKA TADAHIRO·Filed 2011·Application pending·0 cites
- 3140US2014060572A1Plasma processing apparatus and cleaning method for removing metal oxide filmTOKYO ELECTRON LTD·Filed 2013·Application pending·0 cites
- 3237US2012247949A1Film forming method, resputtering method, and film forming apparatusSAKUMA TAKASHI·Filed 2012·Application pending·0 cites
- 3330US2016071707A1Processing apparatusTOKYO ELECTRON LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →