Inventor · disambiguated record
Masatoshi Morikawa
Also filed as: MORIKAWA MASATOSHI
39 granted patents·7 pending applications·733 citations·filing 1991–2022
98Inventor score
Files withHITACHI LTD11RENESAS TECH CORP9HITACHI CONSTRUCTION MACH CO5RENESAS ELECTRONICS CORP5NIPPON PETROCHEMICALS CO LTD4
Top patents by PatentIndex Score
46 records- 0195US6865399B2Mobile telephone apparatusRENESAS TECH CORP·Filed 2002·Granted Mar 8, 2005·93 cites·7 claims
- 0294US6492872B1High frequency power amplifying module and wireless communication apparatusHITACHI LTD·Filed 2000·Granted Dec 10, 2002·68 cites·8 claims
- 0393US8786002B2Semiconductor deviceKONDO MASAO·Filed 2011·Granted Jul 22, 2014·20 cites·2 claims
- 0493US7741656B2Semiconductor device and manufacturing the sameRENESAS TECH CORP·Filed 2009·Granted Jun 22, 2010·14 cites·12 claims
- 0593US6384688B1High-frequency power amplifier moduleHITACHI LTD·Filed 1998·Granted May 7, 2002·87 cites·6 claims
- 0690US6433639B1High frequency power amplifier module and wireless communication systemHITACHI LTD·Filed 2000·Granted Aug 13, 2002·40 cites·10 claims
- 0790US6366788B1Mobile telephone systemHITACHI LTD·Filed 1998·Granted Apr 2, 2002·75 cites·7 claims
- 0889US6528848B1Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2000·Granted Mar 4, 2003·35 cites·50 claims
- 0988US7145394B2High frequency power amplifier module, and wireless communication systemHITACHI TOBU SEMICONDUCTOR LTD·Filed 2005·Granted Dec 5, 2006·12 cites·2 claims
- 1086US6605842B2Semiconductor device and a method of manufacturing the sameHITACHI LTD·Filed 2002·Granted Aug 12, 2003·26 cites·9 claims
- 1184US5379230ASemiconductor integrated circuit having semiconductor output device driving external load and microprocessor unitHITACHI LTD·Filed 1994·Granted Jan 3, 1995·41 cites·4 claims
- 1280US6617927B2High frequency power amplifier module, and wireless communications systemHITACHI LTD·Filed 2002·Granted Sep 9, 2003·20 cites·12 claims
- 1378US7176520B2Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2004·Granted Feb 13, 2007·20 cites·24 claims
- 1477US7087977B2Semiconductor device including multiple wiring layers and circuits operating in different frequency bandsRENESAS E JP SEMICONDUCTOR INC·Filed 2003·Granted Aug 8, 2006·12 cites·4 claims
- 1576US6707102B2Semiconductor device including an insulated gate type field effect transistor and method for fabricating the sameRENESAS TECH CORP·Filed 2001·Granted Mar 16, 2004·29 cites·10 claims
- 1674US8482058B2Semiconductor device including a power MISFETHOSHINO YUTAKA·Filed 2012·Granted Jul 9, 2013·2 cites·6 claims
- 1768US8232595B2Semiconductor device including a power MISFET and method of manufacturing the sameHOSHINO YUTAKA·Filed 2011·Granted Jul 31, 2012·1 cites·4 claims
- 1868US6535069B2High-frequency power amplifier moduleHITACHI LTD·Filed 2002·Granted Mar 18, 2003·13 cites·5 claims
- 1968US5847521AMethod and apparatus for driving an electric motorHITACHI LTD·Filed 1996·Granted Dec 8, 1998·29 cites·5 claims
- 2067US7217987B2Semiconductor device and manufacturing the sameRENESAS E JP SEMICONDUCTOR INC·Filed 2006·Granted May 15, 2007·1 cites·9 claims
- 2166US6897728B2High frequency power amplifier module and wireless communication systemHITACHI TOBU SEMICONDUCTOR LTD·Filed 2003·Granted May 24, 2005·9 cites·24 claims
- 2266US5310833AProcess for feeding catalyst to fluidized bed for vapor phase polymerizationNIPPON PETROCHEMICALS CO LTD·Filed 1993·Granted May 10, 1994·14 cites·8 claims
- 2365US7994567B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted Aug 9, 2011·1 cites·9 claims
- 2465US6797594B2Semiconductor device and method of manufacturing the sameRENESAS TECH CORP·Filed 2001·Granted Sep 28, 2004·7 cites·14 claims
- 2563US7045412B2Field-effect type semiconductor device for power amplifierRENESAS TECH CORP·Filed 2004·Granted May 16, 2006·9 cites·11 claims
- 2663US5638246ASemiconductor device having a protection circuit, and electronic system including the sameHITACHI LTD·Filed 1993·Granted Jun 10, 1997·25 cites·41 claims
- 2761US12297620B2Work machineHITACHI CONSTRUCTION MACH CO·Filed 2021·Granted May 13, 2025·0 cites·6 claims
- 2861US6815707B2Field-effect type semiconductor device for power amplifierRENESAS TECH CORP·Filed 2002·Granted Nov 9, 2004·8 cites·16 claims
- 2961US5385991AMethod for producing polyolefinNIPPON PETROCHEMICALS CO LTD·Filed 1991·Granted Jan 31, 1995·12 cites·10 claims
- 3059US7671381B2Semiconductor device and manufacturing the sameRENESAS E JP SEMICONDUCTOR INC·Filed 2008·Granted Mar 2, 2010·0 cites·26 claims
- 3158US7982263B2Semiconductor device having a plurality of misfets formed on a main surface of a semiconductor substrateRENESAS ELECTRONICS CORP·Filed 2009·Granted Jul 19, 2011·0 cites·3 claims
- 3258US7176523B2Power mosfet having conductor plug structured contactsRENESAS TECH CORP·Filed 2004·Granted Feb 13, 2007·4 cites·29 claims
- 3356US12428812B2Work machineHITACHI CONSTRUCTION MACH CO·Filed 2022·Granted Sep 30, 2025·0 cites·5 claims
- 3456US2023349129A1Work machineHITACHI CONSTRUCTION MACH CO·Filed 2021·Application pending·0 cites
- 3555US2024026641A1Construction machineHITACHI CONSTRUCTION MACH CO·Filed 2021·Application pending·0 cites
- 3652US2007114606A1Semiconductor device and a method of manufacturing the sameRENESAS TECH CORP·Filed 2007·Application pending·0 cites
- 3751US7791131B2Semiconductor device and a method of manufacturing the sameRENESAS ELECTRONICS CORP·Filed 2006·Granted Sep 7, 2010·0 cites·17 claims
- 3850US8080831B2Semiconductor device and manufacturing the sameNAKAYAMA FUMITAKA·Filed 2010·Granted Dec 20, 2011·0 cites·14 claims
- 3949US7479681B2Multilayered semiconductor structure containing a MISFET, a resistor, a capacitor, and an inductorRENESAS EASTERN TECHNOLOGY COR·Filed 2007·Granted Jan 20, 2009·0 cites·1 claims
- 4049US2011254087A1Semiconductor device and a method of manufacturing the sameMIYAKE TOMOYUKI·Filed 2011·Application pending·0 cites
- 4147US2013002338A1Semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2012·Application pending·0 cites
- 4243US2011001543A1Semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 4342US11248364B2Work machineHITACHI CONSTRUCTION MACH CO·Filed 2017·Granted Feb 15, 2022·0 cites·7 claims
- 4442US5202396AProcess for feeding catalyst to fluidized bed for vapor phase polymerizationNIPPON PETROCHEMICALS CO LTD·Filed 1991·Granted Apr 13, 1993·6 cites·4 claims
- 4538US2005173738A1Semiconductor device and manufacturing method of the sameFiled 2005·Application pending·0 cites
- 4629US5525687AMethod for producing polyolefinNIPPON PETROCHEMICALS CO LTD·Filed 1994·Granted Jun 11, 1996·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →