Inventor · disambiguated record
Kazuyuki Mitsukura
Also filed as: MITSUKURA KAZUYUKI
16 granted patents·30 pending applications·31 citations·filing 2008–2024
89Inventor score
Files withRESONAC CORP21MITSUKURA KAZUYUKI9HITACHI CHEMICAL CO LTD6SHOWA DENKO MATERIALS CO LTD6KAWAMORI TAKASHI2
Top patents by PatentIndex Score
46 records- 0193US11979990B2Wiring board and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted May 7, 2024·3 cites·14 claims
- 0290US12004305B2Wiring board and production method for sameSHOWA DENKO MATERIALS CO LTD·Filed 2019·Granted Jun 4, 2024·2 cites·13 claims
- 0388US12426164B2Semiconductor packageRESONAC CORP·Filed 2024·Granted Sep 23, 2025·0 cites·8 claims
- 0487US10388608B2Semiconductor device and method for manufacturing sameHITACHI CHEMICAL CO LTD·Filed 2016·Granted Aug 20, 2019·8 cites·19 claims
- 0584US8258017B2Photosensitive adhesiveMASUKO TAKASHI·Filed 2008·Granted Sep 4, 2012·12 cites·9 claims
- 0680US2024282684A1Substrate and method for manufacturing the sameRESONAC CORP·Filed 2024·Application pending·0 cites
- 0778US11990396B2Substrate and method for manufacturing the sameSHOWA DENKO MATERIALS CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 0873US2024397635A1Wiring structure, method for manufacturing same, and semiconductor packageRESONAC CORP·Filed 2024·Application pending·0 cites
- 0971US10756008B2Organic interposer and method for manufacturing organic interposerHITACHI CHEMICAL CO LTD·Filed 2017·Granted Aug 25, 2020·1 cites·6 claims
- 1070US11562951B2Organic interposer and method for manufacturing organic interposerHITACHI CHEMICAL CO LTD·Filed 2020·Granted Jan 24, 2023·0 cites·20 claims
- 1168US9309446B2Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor deviceMITSUKURA KAZUYUKI·Filed 2012·Granted Apr 12, 2016·3 cites·24 claims
- 1267US12114437B2Wiring structure, method for manufacturing same, and semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2021·Granted Oct 8, 2024·0 cites·9 claims
- 1367US10575402B2Resin composition, wiring layer laminate for semiconductor, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2017·Granted Feb 25, 2020·1 cites·17 claims
- 1466US12376235B2Layered plate and wiring base board production methodRESONAC CORP·Filed 2020·Granted Jul 29, 2025·0 cites·12 claims
- 1561US10428253B2Photosensitive resin composition, film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2013·Granted Oct 1, 2019·1 cites·17 claims
- 1655US2023259026A1Photosensitive resin composition, method of producing patterned cured product using the same, and cured product of photosensitive resin compositionSHOWA DENKO MATERIALS CO LTD·Filed 2022·Application pending·0 cites
- 1753US2025267799A1Method for manufacturing wiring board, method for evaluating resist layer or wiring board, and wiring boardRESONAC CORP·Filed 2023·Application pending·0 cites
- 1850US8507323B2Method of producing semiconductor device with patterned photosensitive adhesiveMASUKO TAKASHI·Filed 2012·Granted Aug 13, 2013·0 cites·9 claims
- 1950US2024088051A1Method for producing semiconductor device, wiring board, and semiconductor deviceRESONAC CORP·Filed 2022·Application pending·0 cites
- 2050US2024341039A1Method for manufacturing wiring board, and wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 2149US2024030044A1Method for manufacturing wiring board, method for manufacturing semiconductor device, and resin sheetRESONAC CORP·Filed 2021·Application pending·0 cites
- 2249US2025168975A1Core substrate for wiring boards and method for producing same, and wiring board and method for producing sameRESONAC CORP·Filed 2022·Application pending·0 cites
- 2348US8349700B2Photosensitive adhesive, semiconductor device and method for manufacturing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jan 8, 2013·0 cites·10 claims
- 2448US2023356498A1Organic core material, production method for same, laminate including organic core material, and circuit boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 2548US2024381529A1Method for manufacturing substrate material for semiconductor package, prepreg, and application for prepregRESONAC CORP·Filed 2021·Application pending·0 cites
- 2648US2024250025A1Method for manufacturing semiconductor device and semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 2748US2023331946A1Method for manufacturing substrate material for semiconductor package, prepreg, and substrate material for semiconductor packageRESONAC CORP·Filed 2021·Application pending·0 cites
- 2847US12405198B2Photosensitive resin composition, method for selecting photosensitive resin composition, method for producing patterned cured film, and method for producing semiconductor deviceSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Sep 2, 2025·0 cites·14 claims
- 2947US2025266342A1Manufacturing method for thin wiring member, thin wiring member, and manufacturing method for wiring boardRESONAC CORP·Filed 2022·Application pending·0 cites
- 3047US2024057263A1Method for producing wiring board, laminate and method for producing sameRESONAC CORP·Filed 2021·Application pending·0 cites
- 3147US2024015889A1Method for producing wiring board, and wiring boardRESONAC CORP·Filed 2021·Application pending·0 cites
- 3247US2025293200A1Laminate manufacturing method, insulation material, and laminateRESONAC CORP·Filed 2022·Application pending·0 cites
- 3346US2011159238A1Photosensitive adhesive composition, photosensitive film adhesive, adhesive pattern, semiconductor wafer with adhesive, semiconductor device and electronic componentKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
- 3446US2023253215A1Method for producing circuit boardRESONAC CORP·Filed 2020·Application pending·0 cites
- 3546US2011223397A1Semiconductor device and method for manufacturing the sameKAWAMORI TAKASHI·Filed 2009·Application pending·0 cites
- 3642US2025344324A1Pattern formation method and pattern formation structureRESONAC CORP·Filed 2022·Application pending·0 cites
- 3742US2024361697A1Method for selecting photosensitive resin composition, method for producing patterned cured film, cured film, semiconductor device, and method for producing semiconductor deviceRESONAC CORP·Filed 2021·Application pending·0 cites
- 3841US2011151195A1Photosensitive adhesive composition, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer and semiconductor device using the photosensitive adhesive compositionMITSUKURA KAZUYUKI·Filed 2009·Application pending·0 cites
- 3941US2025105205A1Laminate manufacturing method and laminateRESONAC CORP·Filed 2021·Application pending·0 cites
- 4040US2011121435A1Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2009·Application pending·0 cites
- 4139US2010143673A1Photosensitive adhesive composition, film-like adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and semiconductor device manufacturing methodMITSUKURA KAZUYUKI·Filed 2008·Application pending·0 cites
- 4239US2010295190A1Photosensitive adhesive composition, film-like adhesive, adhesive sheet, method for forming adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device and method for manufacturing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2008·Application pending·0 cites
- 4332US2012256326A1Adhesive composition, semiconductor device making use thereof, and production method thereofMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 4431US2012263946A1Semiconductor device, method for manufacturing semiconductor device, and semiconductor wafer provided with adhesive layerMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 4531US2012248634A1Method for manufacturing film-like adhesive, adhesive sheet, semiconductor device, and method for manufacturing semiconductor deviceMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
- 4631US2012133061A1Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using sameMITSUKURA KAZUYUKI·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →