Photosensitive adhesive composition, filmy adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, semiconductor device, and process for producing semiconductor device

Abstract

A photosensitive adhesive composition that comprises (A) a resin with a carboxyl and/or hydroxyl group, (B) a thermosetting resin, (C) a radiation-polymerizable compound and (D) a photoinitiator, wherein the 3% weight reduction temperature of the entire photoinitiator mixture in the composition is 200° C. or greater.

1 . A photosensitive adhesive composition comprising:
 (A) a resin with a carboxyl and/or hydroxyl group,   (B) a thermosetting resin,   (C) a radiation-polymerizable compound, and   (D) a photoinitiator,
 wherein a 3% weight reduction temperature of an entirety of the photoinitiator in the composition is 200° C. or greater. 
   
     
     
         2 . The photosensitive adhesive composition according to  claim 1 , wherein the (D) photoinitiator contains a compound having a molar absorption coefficient of 1000 ml/g·cm or greater for light with a wavelength of 365 nm. 
     
     
         3 . The photosensitive adhesive composition according to  claim 1 , wherein the (D) photoinitiator contains a compound with a carbazole group. 
     
     
         4 . The photosensitive adhesive composition according to  claim 1 , wherein the (D) photoinitiator contains a compound with an oxime ester group. 
     
     
         5 . The photosensitive adhesive composition according to  claim 1 , wherein the (D) photoinitiator contains a compound represented by the following structural formula (1): 
       
         
           
           
               
               
           
         
       
     
     
         6 . The photosensitive adhesive composition according to  claim 1 , wherein the (B) thermosetting resin is an epoxy resin. 
     
     
         7 . The photosensitive adhesive composition according to  claim 1 , wherein the (A) resin with a carboxyl and/or hydroxyl group has a glass transition temperature of not greater than 150° C. and a weight-average molecular weight of 5000-300000. 
     
     
         8 . The photosensitive adhesive composition according to  claim 1 , wherein the (A) resin with a carboxyl and/or hydroxyl group is an alkali-soluble resin. 
     
     
         9 . The photosensitive adhesive composition according to  claim 1 , wherein the (A) resin with a carboxyl and/or hydroxyl group is a polyimide resin. 
     
     
         10 . The photosensitive adhesive composition according to  claim 9 , wherein the polyimide resin is a polyimide resin obtained by reaction between a tetracarboxylic dianhydride and a diamine component containing a diamine with a carboxyl and/or hydroxyl group in a molecule. 
     
     
         11 . The photosensitive adhesive composition according to  claim 9 , wherein the polyimide resin is a polyimide resin obtained by reaction between a tetracarboxylic dianhydride and an aromatic diamine represented by the following structural formula (2) and/or an aromatic diamine represented by the following structural formula (3): 
       
         
           
           
               
               
           
         
       
     
     
         12 . The photosensitive adhesive composition according to  claim 10 , wherein the diamine component further contains an aliphatic etherdiamine represented by the following formula (4) at 10-90 mol % of the total diamine component: 
       
         
           
           
               
               
           
         
         [In the formula, Q 1 , Q 2  and Q 3  each independently represent a C1-10 alkylene group, and b represents an integer of 1-80.]. 
       
     
     
         13 . The photosensitive adhesive composition according to  claim 10 , wherein the diamine component further contains a siloxanediamine represented by the following formula (5) at 1-20 mol % of the total diamine component: 
       
         
           
           
               
               
           
         
         [In the formula, Q 4  and Q 9  each independently represent a C1-5 alkylene or optionally substituted phenylene group, Q 5 , Q 6 , Q 7  and Q 8  each independently represent a C1-5 alkyl, phenyl or phenoxy group, and d represents an integer of 1-5.]. 
       
     
     
         14 . The photosensitive adhesive composition according to  claim 9 , wherein the polyimide resin is a polyimide resin obtained by reaction between a tetracarboxylic dianhydride and a diamine component, and the tetracarboxylic dianhydride contains a tetracarboxylic dianhydride represented by the following formula (6) at 40 mol % or greater of the total tetracarboxylic dianhydrides: 
       
         
           
           
               
               
           
         
       
     
     
         15 . A film-like adhesive composed of the photosensitive adhesive composition according to  claim 1 . 
     
     
         16 . An adhesive sheet comprising a base and an adhesive layer composed of the photosensitive adhesive composition according to  claim 1  formed on one side of the base. 
     
     
         17 . An adhesive sheet comprising the film-like adhesive according to  claim 15  and a dicing sheet,
 wherein the film-like adhesive and the dicing sheet are laminated. 
 
     
     
         18 . An adhesive pattern formed by forming an adhesive layer composed of the photosensitive adhesive composition according to  claim 1  on an adherend, exposing the adhesive layer to light through a photomask, and developing the exposed adhesive layer with an alkali developing solution. 
     
     
         19 . A semiconductor wafer with an adhesive layer, comprising a semiconductor wafer and an adhesive layer composed of the photosensitive adhesive composition according to  claim 1  formed on one side of the semiconductor wafer. 
     
     
         20 . A semiconductor device comprising a supporting member, a semiconductor element mounted on the supporting member and an adhesive layer situated between the supporting member and semiconductor element, wherein the adhesive layer is formed of the photosensitive adhesive composition according to  claim 1 . 
     
     
         21 . A process for producing a semiconductor device, comprising a step of bonding a semiconductor element and a supporting member for mounting a semiconductor element by the photosensitive adhesive composition according to  claim 1 .