Inventor · disambiguated record
Ting-Chiang Huang
Also filed as: HUANG TING-CHIANG
18 granted patents·12 pending applications·108 citations·filing 2004–2024
92Inventor score
Top patents by PatentIndex Score
30 records- 0192US12133352B2Dual parallel path cooling system for dual socket information handling systemsDELL PRODUCTS LP·Filed 2021·Granted Oct 29, 2024·2 cites·18 claims
- 0289US8542486B2Electronic apparatus with improved heat dissipationLIN WEI-YI·Filed 2011·Granted Sep 24, 2013·18 cites·9 claims
- 0388US7619894B2Heat dissipation deviceINVENTEC CORP·Filed 2008·Granted Nov 17, 2009·23 cites·7 claims
- 0483US7946336B2Heat sink structureINVENTEC CORP·Filed 2008·Granted May 24, 2011·12 cites·7 claims
- 0579US9086854B2Hinge assembly and electronic device using the sameACER INC·Filed 2012·Granted Jul 21, 2015·5 cites·10 claims
- 0670US7835152B2Heat dissipating moduleINVENTEC CORP·Filed 2009·Granted Nov 16, 2010·7 cites·9 claims
- 0770US7826227B2Heat dissipation deviceINVENTEC CORP·Filed 2008·Granted Nov 2, 2010·5 cites·6 claims
- 0869US7621725B2Swing type fanINVENTEC CORP·Filed 2008·Granted Nov 24, 2009·6 cites·6 claims
- 0968US9255585B2Fan structure and casing structureINVENTEC PUDONG TECH CORP·Filed 2013·Granted Feb 9, 2016·2 cites·5 claims
- 1066US8730663B2Electronic apparatusDU SUNG NIEN·Filed 2012·Granted May 20, 2014·4 cites·9 claims
- 1165US7940528B2Electronic device and heat sink thereofINVENTEC CORP·Filed 2009·Granted May 10, 2011·3 cites·10 claims
- 1264US7204750B2Airflow guide structure and manufacture thereofFIRST INT COMPUTER INC·Filed 2004·Granted Apr 17, 2007·20 cites·14 claims
- 1356US2025048598A1System airflow bypassing restricted rear i/o panel via power supply unit regionDELL PRODUCTS LP·Filed 2023·Application pending·0 cites
- 1455US12032507B1Managing peripheral component interconnect express slots of an information handling systemDELL PRODUCTS LP·Filed 2023·Granted Jul 9, 2024·0 cites·20 claims
- 1555US7775778B2Heat dissipation moduleINVENTEC CORP·Filed 2007·Granted Aug 17, 2010·1 cites·6 claims
- 1652US2025378231A1Weighted thermal sensor clustering system and methodDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 1750US11314612B2System and methods for intelligent fan identification including fan quantity change detecting during POSTDELL PRODUCTS LP·Filed 2020·Granted Apr 26, 2022·0 cites·18 claims
- 1850US2025244803A1Carrier module to provide a thermal solution for stacked compression attached memory modulesDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 1950US2025247983A1Carrier module for grounding stacked compression attached memory modulesDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 2050US2025244802A1Carrier module for stacked compression attached memory modulesDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 2147US2010128438A1Heat dissipation moduleINVENTEC CORP·Filed 2009·Application pending·0 cites
- 2243US2009321055A1Loop heat pipeINVENTEC CORP·Filed 2009·Application pending·0 cites
- 2342US10859326B2Fin stack for processor coolingDELL PRODUCTS LP·Filed 2019·Granted Dec 8, 2020·0 cites·20 claims
- 2442US2014090819A1Heat dissipation deviceINVENTEC PUDONG TECH CORP·Filed 2013·Application pending·0 cites
- 2537US2012127662A1Electronic apparatus and keyboard supporting module thereofSUN KUANG-CHUNG·Filed 2010·Application pending·0 cites
- 2637US2016258691A1Heat dissipation moduleACER INC·Filed 2015·Application pending·0 cites
- 2735US8929072B2Heat dissipating moduleLIN WEI-YI·Filed 2011·Granted Jan 6, 2015·0 cites·7 claims
- 2833US2012125570A1Heat dissipating deviceWANG FENG-KU·Filed 2011·Application pending·0 cites
- 2931US2011075369A1Electronic deviceINVENTEC CORP·Filed 2010·Application pending·0 cites
- 3028US9017023B2Fan structure and electronic device applied with the sameHSIAO FEI-KAI·Filed 2012·Granted Apr 28, 2015·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →