Heat dissipation device

Abstract

A heat dissipation device includes a fan module, a first plate structure and a fin assembly. The fan module includes a fan outlet. The first plate structure is disposed at the fan outlet. The thermal conductance of the first plate structure is above 100 W/(m·K). The first plate structure includes a heat-absorbing and a heat-dissipation surface. The heat-absorbing surface includes a heat-absorbing region in thermal contact with a heat source. The heat-dissipation surface includes a heat-dissipation region. The fin assembly is disposed on the heat-dissipation surface and in thermal contact with the heat-dissipation surface. The fan module is adapted to exhaust an air flow flowing above the heat-dissipation surface via the fan outlet. The air flow flows through the heat-dissipation region before through the fin assembly. The distance between the fan outlet and the heat-dissipation region is greater than the distance between the fan outlet and the fin assembly.

What is claimed is: 
     
         1 . A heat dissipation device, comprising:
 a fan module including a fan outlet;   a first plate structure disposed at the fan outlet, the thermal conductance of the first plate structure being greater than or equal to 100 W/(m·K), the first plate structure including a heat-absorbing surface and a heat-dissipation surface, the heat-absorbing surface including a heat-absorbing region for being in thermal contact with a heat source, the heat-dissipation surface including a heat-dissipation region; and   a fin assembly disposed on the heat-dissipation surface, and the fin assembly being in thermal contact with the heat-dissipation surface, the fan module being adapted to exhaust an air flow flowing above the heat-dissipation surface via the fan outlet, wherein the air flow flows through the heat-dissipation region before through the fin assembly, and wherein the shortest distance between the fan outlet and the heat-dissipation region is greater than the shortest distance between the fan outlet and the fin assembly.   
     
     
         2 . The heat dissipation device according to  claim 1 , wherein the material of the first plate structure is graphite. 
     
     
         3 . The heat dissipation device according to  claim 1 , further comprising a second plate structure disposed at the fan outlet, wherein a gap is formed between the first plate structure and the second plate structure, and wherein the fan outlet is positioned between the first plate structure and the second plate structure. 
     
     
         4 . The heat dissipation device according to  claim 1 , wherein the thermal conductance of the second plate structure is greater than 100 W/(m·K). 
     
     
         5 . The heat dissipation device according to  claim 4 , wherein the thermal conductance of the second plate structure is graphite. 
     
     
         6 . The heat dissipation device according to  claim 3 , further comprising a first deflector, the fin assembly including a first end and a second end opposite to each other, the first end being in the vicinity of the fan outlet, the second end being farther away from the fan outlet, the first deflector positioned between the first plate structure and the second plate structure, the heat-absorbing region positioned among the fan module, the first deflector and the fin assembly, the first deflector being extending from the fan outlet to the second end of the fin assembly, wherein the first plate structure, the first deflector and the fin assembly together form a channel including an air inlet and an exhaust outlet, and wherein the fan outlet faces towards the air inlet, and the fin assembly is disposed at the exhaust outlet. 
     
     
         7 . The heat dissipation device according to  claim 6 , wherein the first plate structure further comprises a first plate component, a second plate component and a link plate component connected to the first plate component and the second plate component, the first plate structure is disposed on a circuit board, the heat-absorbing surface and the heat-absorbing region is positioned on the second plate component, the second plate component and the link plate component are disposed between the circuit board and the second plate structure, wherein the circuit board, the second plate structure, the first deflector and the fin assembly together form a channel including an air inlet and an exhaust outlet, the fan outlet faces towards the air inlet, and the fin assembly is disposed at the exhaust outlet. 
     
     
         8 . The heat dissipation device according to  claim 3 , further comprising a first deflector and a second deflector disposed at two opposite sides of the first plate structure, respectively, the fin assembly including a first end and a second end opposite to each other, the first end being in the vicinity of the fan outlet, the second end being in vicinity of the fan outlet, the second plate structure disposed on the first deflector and the second deflector such that the first plate structure, the second plate structure, the first deflector and the second deflector together form a channel including an air inlet and an exhaust outlet, the fan outlet faces towards the air inlet, and the fin assembly is disposed at the exhaust outlet. 
     
     
         9 . The heat dissipation device according to  claim 3 , wherein the first plate structure comprises a first plate component, a second plate component and a link plate component connected to the first plate component and the second plate component, the gap is positioned between the first plate component and the second plate structure, the second plate component is positioned at the gap, and the heat-absorbing region and the heat-dissipation region are disposed at two opposite surfaces of the second plate component. 
     
     
         10 . The heat dissipation device according to  claim 1 , further comprising a third deflector disposed on the heat-dissipation surface of the first plate structure and extending from an end of the first plate structure on the vicinity of the fan outlet towards the fin assembly.