Inventor · disambiguated record
Rodolfo P. Belen
Also filed as: BELEN JR RODOLFO P · BELEN RODOLFO · BELEN RODOLFO P
6 granted patents·5 pending applications·197 citations·filing 2007–2016
84Inventor score
Top patents by PatentIndex Score
11 records- 0197US7863060B2Method of double patterning and etching magnetic tunnel junction structures for spin-transfer torque MRAM devicesMAGIC TECHNOLOGIES INC·Filed 2009·Granted Jan 4, 2011·85 cites·22 claims
- 0295US8722543B2Composite hard mask with upper sacrificial dielectric layer for the patterning and etching of nanometer size MRAM devicesBELEN RODOLFO·Filed 2010·Granted May 13, 2014·79 cites·20 claims
- 0389US8066895B2Method to control uniformity using tri-zone showerheadBELEN RODOLFO P·Filed 2008·Granted Nov 29, 2011·18 cites·23 claims
- 0483US8236133B2Plasma reactor with center-fed multiple zone gas distribution for improved uniformity of critical dimension biasKATZ DAN·Filed 2008·Granted Aug 7, 2012·13 cites·9 claims
- 0564US9711359B2Shadow trim line edge roughness reductionLAM RES CORP·Filed 2015·Granted Jul 18, 2017·1 cites·8 claims
- 0656US8017526B2Gate profile control through effective frequency of dual HF/VHF sources in a plasma etch processAPPLIED MATERIALS INC·Filed 2007·Granted Sep 13, 2011·1 cites·17 claims
- 0753US2009221150A1Etch rate and critical dimension uniformity by selection of focus ring materialAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 0848US2009221149A1Multiple port gas injection system utilized in a semiconductor processing systemHAMMOND IV EDWARD P·Filed 2008·Application pending·0 cites
- 0947US2017011891A1Etch rate and critical dimension uniformity by selection of focus ring materialAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
- 1042US2009156011A1Method of controlling CD bias and CD microloading by changing the ceiling-to-wafer gap in a plasma reactorBELEN RODOLFO P·Filed 2007·Application pending·0 cites
- 1142US2008149592A1Plasma etch process for controlling line edge roughnessBELEN RODOLFO P·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →