Inventor · disambiguated record
Yorim Lee
Also filed as: LEE YORIM
5 granted patents·20 citations·filing 2007–2011
76Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0177US7615865B2Standoff height improvement for bumping technology using solder resistSTATS CHIPPAC LTD·Filed 2007·Granted Nov 10, 2009·8 cites·21 claims
- 0272US7898072B2Package stacking system with mold contamination preventionSTATS CHIPPAC LTD·Filed 2008·Granted Mar 1, 2011·5 cites·14 claims
- 0367US7682872B2Integrated circuit package system with underfillSTATS CHIPPAC LTD·Filed 2008·Granted Mar 23, 2010·4 cites·18 claims
- 0466US8143103B2Package stacking system with mold contamination prevention and method for manufacturing thereofKIM YOUNG-JOON·Filed 2011·Granted Mar 27, 2012·2 cites·10 claims
- 0557US7875495B2Standoff height improvement for bumping technology using solder resistSTATS CHIPPAC LTD·Filed 2009·Granted Jan 25, 2011·1 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →