Inventor · disambiguated record
Brenda Peterson
Also filed as: PETERSON BRENDA · PETERSON BRENDA L · PETERSON BRENDA LEE
20 granted patents·5 pending applications·494 citations·filing 1995–2007
96Inventor score
Top patents by PatentIndex Score
25 records- 0192US6740959B2EMI shielding for semiconductor chip carriersIBM·Filed 2001·Granted May 25, 2004·97 cites·28 claims
- 0292US5808268AMethod for marking substratesIBM·Filed 1996·Granted Sep 15, 1998·60 cites·15 claims
- 0388US6458623B1Conductive adhesive interconnection with insulating polymer carrierIBM·Filed 2001·Granted Oct 1, 2002·45 cites·29 claims
- 0488US6429388B1High density column grid array connections and method thereofIBM·Filed 2000·Granted Aug 6, 2002·53 cites·14 claims
- 0579US6486415B2Compliant layer for encapsulated columnsIBM·Filed 2001·Granted Nov 26, 2002·20 cites·2 claims
- 0675US5927193AProcess for via fillIBM·Filed 1997·Granted Jul 27, 1999·50 cites·10 claims
- 0767US5645673ALamination process for producing non-planar substratesIBM·Filed 1995·Granted Jul 8, 1997·31 cites·10 claims
- 0863US5787578AMethod of selectively depositing a metallic layer on a ceramic substrateIBM·Filed 1996·Granted Aug 4, 1998·31 cites·19 claims
- 0962US7278207B2Method of making an electronic packageIBM·Filed 2005·Granted Oct 9, 2007·1 cites·5 claims
- 1062US6543347B2Apparatus for displacing an article during screeningIBM·Filed 2001·Granted Apr 8, 2003·10 cites·36 claims
- 1161US6402866B1Powdered metallic sheet method for deposition of substrate conductorsIBM·Filed 1999·Granted Jun 11, 2002·25 cites·17 claims
- 1258US6341417B1Pre-patterned substrate layers for being personalized as neededIBM·Filed 1999·Granted Jan 29, 2002·19 cites·15 claims
- 1353US2007278654A1Method of making an electronic packageJIMAREZ LISA J·Filed 2007·Application pending·0 cites
- 1452US6961995B2Method of making an electronic packageIBM·Filed 2002·Granted Nov 8, 2005·3 cites·3 claims
- 1551US5846361ALamination process for producing non-planar substratesIBM·Filed 1996·Granted Dec 8, 1998·15 cites·8 claims
- 1648US6017025AComponent retainerIBM·Filed 1996·Granted Jan 25, 2000·13 cites·2 claims
- 1748US2008076690A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2007·Application pending·0 cites
- 1847US6836015B2Optical assemblies for transmitting and manipulating optical beamsIBM·Filed 2003·Granted Dec 28, 2004·1 cites·20 claims
- 1946US8089133B2Optical assemblies for transmitting and manipulating optical beamsGUPTA DINESH·Filed 2004·Granted Jan 3, 2012·1 cites·12 claims
- 2046US6595136B2Method for displacing an article during screeningIBM·Filed 2001·Granted Jul 22, 2003·2 cites·21 claims
- 2143US5996985AComponent retainerIBM·Filed 1998·Granted Dec 7, 1999·10 cites·16 claims
- 2239US2005066995A1Non-hermetic encapsulant removal for module reworkIBM·Filed 2003·Application pending·0 cites
- 2338US6475555B2Process for screening features on an electronic substrate with a low viscosity pasteIBM·Filed 1999·Granted Nov 5, 2002·7 cites·6 claims
- 2438US2002023779A1Pre-patterned substrate layers for being personalized as neededFiled 2001·Application pending·0 cites
- 2534US2003104687A1Temporary chip attach structure with thin filmsIBM·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →