Inventor · disambiguated record
Paul Lee Clouser
Also filed as: CLOUSER PAUL · CLOUSER PAUL L · CLOUSER PAUL LEE
10 granted patents·2 pending applications·218 citations·filing 1977–2012
90Inventor score
Top patents by PatentIndex Score
12 records- 0171US5884053AConnector for higher performance PCI with differential signalingIBM·Filed 1997·Granted Mar 16, 1999·61 cites·22 claims
- 0270US6607125B1Handheld merchandise scanner deviceIBM·Filed 1999·Granted Aug 19, 2003·44 cites·28 claims
- 0370US6070211ADriver/receiver circuitry for enhanced PCI bus with differential signalingIBM·Filed 1997·Granted May 30, 2000·59 cites·32 claims
- 0466US6477057B1High frequency de-coupling via short circuitsIBM·Filed 2000·Granted Nov 5, 2002·12 cites·11 claims
- 0562US7197446B2Hierarchical method of power supply noise and signal integrity analysisIBM·Filed 2004·Granted Mar 27, 2007·9 cites·30 claims
- 0660US6495911B1Scalable high frequency integrated circuit packageIBM·Filed 2000·Granted Dec 17, 2002·8 cites·11 claims
- 0756US6483720B1EMC protection in digital computersIBM·Filed 2000·Granted Nov 19, 2002·5 cites·10 claims
- 0849US6514090B1Method and apparatus for high speed differential signaling, employing split pin connectors and split via technologyIBM·Filed 1998·Granted Feb 4, 2003·13 cites·29 claims
- 0944US2013088315A1Transformer with arbitrarily small leakage-inductance apparatus and methodSEDONA INTERNATIONAL INC·Filed 2012·Application pending·0 cites
- 1038US4115749AMicrowave hybrid phase matching spacerUS AIR FORCE·Filed 1977·Granted Sep 19, 1978·7 cites·1 claims
- 1138US2002186554A1Method for manufacturing a scalable high frequency integrated circuit packageFiled 2002·Application pending·0 cites
- 1229US8699238B1Method and apparatus for stabilizing power convertersTONG ARTHUR·Filed 2011·Granted Apr 15, 2014·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Paul Lee Clouser files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →